Surface Treated Copper Foil for High Speed Printed Circuit Board Products Including the Copper Foil and Methods of Making

A surface treatment, high-speed printing technology, used in printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems such as signal loss

Active Publication Date: 2019-07-12
CHANG CHUN PETROCHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] After many studies, the inventors of the present invention found that the copper foil with roughened particle treatment on the surface of the roller has a surface roughness (

Method used

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  • Surface Treated Copper Foil for High Speed Printed Circuit Board Products Including the Copper Foil and Methods of Making
  • Surface Treated Copper Foil for High Speed Printed Circuit Board Products Including the Copper Foil and Methods of Making
  • Surface Treated Copper Foil for High Speed Printed Circuit Board Products Including the Copper Foil and Methods of Making

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Roller polishing with buffing wheels

[0076] Roller speed: 1.0-5.0m / min

[0077] Polishing wheel speed: 150-550rpm (#1500, Nippon Tokushu Kento Co., Ltd.)

[0078] Load current: 0.5-1.5A

[0079] Preparation of electrolytic copper foil (untreated copper foil)

[0080] Copper wire was dissolved in 50% by weight of sulfuric acid aqueous solution to prepare 320g / L copper sulfate pentahydrate (CuSO 4 ·5H 2 O) and the copper sulfate electrolyte of 100g / L sulfuric acid. For each liter of copper sulfate electrolyte, 20 mg chloride ion, 0.35 mg gelatin (DV, Nippi Company) were added. Subsequently, at a liquid temperature of 50°C and 70A / dm 2 An electrolytic copper foil (untreated copper foil) with a thickness of 18 μm was prepared at a current density of 100 μm.

[0081] A typical apparatus for preparing electrolytic copper foil includes a metal cathode roll and an insoluble metal anode, generally as image 3 As shown, the metal cathode roll rotates about a central lon...

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Abstract

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from thecopper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Description

technical field [0001] The present disclosure relates to a copper foil capable of immediately transmitting high-frequency electronic signals on the order of 100 MHz or more, which allows current to pass only through the surface of a conductor to reduce the skin effect. Also disclosed are printed circuit boards (PCBs) incorporating copper foil and electronic circuitry, and devices incorporating copper foil. Also disclosed are methods of preparing copper foil and products incorporating the same. Background technique [0002] Higher frequency electronic signals have become a requirement for new electronic devices, such as personal computers, mobile communication devices including mobile phones and wearable devices, self-driving vehicles including cars and trucks, aviation devices including manned or unmanned vehicles , and vehicles, where manned or unmanned vehicles include aircraft, unmanned aerial vehicles, missiles, and space facilities including artificial satellites, spac...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D5/02C25D5/12C25D5/48C25D7/06C25D15/00C25F3/26H05K3/02
CPCC25D5/12C25D5/14C25D1/04C25D5/028C25D5/48C25D7/0614C25D15/00C25F3/26C25D5/605H05K3/022B32B15/01C25D3/08C25D3/12C25D3/38H05K3/025H05K3/384H05K3/389H05K2203/0307C23C28/3225C23C28/34C23C2222/20C25D11/36H05K1/09B05D1/02B32B15/08B32B2457/08C25D1/10H05K1/0242H05K3/188H05K2203/0134H05K2203/0723
Inventor 赖耀生郑桂森周瑞昌
Owner CHANG CHUN PETROCHEMICAL CO LTD
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