Surface Treated Copper Foil for High Speed Printed Circuit Board Products Including the Copper Foil and Methods of Making

Abstract

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from thecopper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Description

technical field [0001] The present disclosure relates to a copper foil capable of immediately transmitting high-frequency electronic signals on the order of 100 MHz or more, which allows current to pass only through the surface of a conductor to reduce the skin effect. Also disclosed are printed circuit boards (PCBs) incorporating copper foil and electronic circuitry, and devices incorporating copper foil. Also disclosed are methods of preparing copper foil and products incorporating the same. Background technique [0002] Higher frequency electronic signals have become a requirement for new electronic devices, such as personal computers, mobile communication devices including mobile phones and wearable devices, self-driving vehicles including cars and trucks, aviation devices including manned or unmanned vehicles , and vehicles, where manned or unmanned vehicles include aircraft, unmanned aerial vehicles, missiles, and space facilities including artificial satellites, spac...

AI Technical Summary

Problems solved by technology

[0008] After many studies, the inventors of the present invention found that the copper foil with roughened particle treatment on the surface of the roller has a surface roughness (Rz) of 1.5 to 3.1 μm and a surface roughness (Rz) of 15% to 30%. The difference between the reflectivity at 570nm and the reflectivity at 610nm can solve the problem of signal loss

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