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Coating for enhancing reliability of Sn-based solder/Kovar alloy interconnection solder joint and preparation process thereof

A technology of preparation process and reliability, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of insufficient research on the interface reaction and performance of brazing solder joints, lack of research on mechanical properties, etc., to achieve intermetallic compounds Generation suppression, enhanced solder joint reliability, and ease of operation

Inactive Publication Date: 2019-07-19
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The previous research on Kovar was mainly to study its brazing connection with ceramic plates, and the research on the interface reaction and performance of its brazing joints is still slightly insufficient; the research on the interface reaction and mechanical properties of tin-based solder / Kovar solder joints is extremely scarce

Method used

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  • Coating for enhancing reliability of Sn-based solder/Kovar alloy interconnection solder joint and preparation process thereof
  • Coating for enhancing reliability of Sn-based solder/Kovar alloy interconnection solder joint and preparation process thereof
  • Coating for enhancing reliability of Sn-based solder/Kovar alloy interconnection solder joint and preparation process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0025] A substrate copper plating layer for enhancing the reliability of Sn-based solder / Kovar alloy interconnect solder joints and its preparation process. The Kovar alloy with Ni / Au double-coating on the surface is selected as the substrate, the thickness of the Ni layer is 4 μm, and the thickness of the Au layer on the Ni layer is 2 μm. Electroplate a layer of Cu film on its surface again, and the electroplating time is about 0 minutes.

[0026] The electroplating solution is prepared by mixing and dissolving copper sulfate, sulfuric acid, hydrochloric acid and PEG in water and stirring evenly. The copper sulfate in the electroplating solution is 150g / L, the sulfuric acid is 120g / L, the hydrochloric acid is 0.3g / L, and the PEG is 0.1g / L. In the electroplating operation, the Kovar alloy substrate with Ni / Au double plating on the surface is used as the cathode, and the pure copper plate is used as the anode, and a direct current is passed in; the current density is 2A / dm 2 ...

Embodiment 2

[0028] The method of this embodiment is the same as that of Embodiment 1, except that the electroplating time is 2 minutes.

Embodiment 3

[0030] The method of this embodiment is the same as that of Embodiment 1, except that the electroplating time is 5 minutes.

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Abstract

The invention discloses a coating for enhancing reliability of a Sn-based solder / Kovar alloy interconnection solder joint and a preparation process thereof, and belongs to the technical field of electronic packaging and interconnection. The Kovar alloy with a Ni / Au double coating on the surface is selected as a substrate, and a layer of Cu film is plated on the surface of the alloy substrate to prepare an Au / Ni / Kovar alloy substrate with the Cu film plated on the surface. The preparation method of the coating comprises the following steps of under the water bath condition of 40 DEG C, using the flat Kovar alloy substrate as a plating cathode, and using a pure copper plate as a plating anode so as to introduce direct current for plating to form a copper coating on the surface of the cathode. The coating has the advantages of simple process flow, easy control of process parameters and the like, and the Cu electroplating process effectively improves the reliability of the Sn-based solder / Kovar alloy interconnection solder joint.

Description

technical field [0001] The invention relates to a metal surface coating and a preparation method thereof, in particular to a coating for enhancing the reliability of Sn-based solder / Kovar alloy interconnect solder joints and a preparation process thereof, belonging to the technical field of electronic packaging and interconnection. Background technique [0002] In the microelectronic packaging and assembly industry, in order to meet the increasing living needs of human beings, electronic systems are developing towards multi-functionality, high performance, low power consumption, and small size. Today, with the rapid progress of science and technology, there are more and more applications of brazing joints, which has caused a problem that the solder joints cannot meet the requirements of current material life. In many applications, the single excellent performance of a single material cannot meet the increasing material needs at all. At this time, a method that can combine th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C25D3/38
CPCB23K35/262C25D3/38
Inventor 胡小武鲍泥发江雄心李玉龙
Owner NANCHANG UNIV