Halogen-free epoxy resin composition, laminated plate and printed circuit board

Abstract

The invention discloses a halogen-free epoxy resin composition, a laminated plate and a printed circuit board, wherein the halogen-free epoxy resin composition comprises, by weight, 100 parts of a halogen-free naphthalene type epoxy resin, 10-25 parts of a DOPO-modified hardener, 25-45 parts of a cyanate resin, 35-60 parts of bismaleimide, 45-65 parts of a non-DOPO flame retardant, and 0.5-15 parts of a hardening accelerator. According to the present invention, the halogen-free epoxy resin composition can provide the halogen-free epoxy resin composition, such that the halogen-free epoxy resincomposition can have characteristics of high glass transition temperature, low dielectric constant, low dielectric loss, high heat resistance and high storage modulus.

Description

technical field [0001] The invention relates to a resin composition and a laminate and a printed circuit board using the resin composition, in particular to a halogen-free epoxy resin composition and a laminate and a printed circuit board using the halogen-free epoxy resin composition . Background technique [0002] With the continuous fever of the communication electronics market, high-frequency and high-speed transmission has become a necessary option, and the circuit board that plays the role of carrying components, power supply and signal transmission has become the key to the development of this field. The existing technology epoxy resin and phenolic Printed circuit boards made of resin materials can no longer meet the advanced applications of high frequency. [0003] In printed circuit board technology, it is mainly a thermosetting resin composition including epoxy resin and hardener, which is heated and combined with a reinforcing material (such as glass fiber cloth)...

AI Technical Summary

Problems solved by technology

The general thermosetting resin composition uses a phenol novolac resin hardener with a hydroxyl group (-OH). When combined with an epoxy resin, the epoxy group will open to form a hydroxyl group, and the hydroxyl group will increase the dielectric constant and dielectric. loss value, and is easy to compare with H 2 O bonding, causing increased hygroscopicity

[0004] The epoxy resin compositions of the prior art use halogen-containing flame retardants (especially brominated flame retardants), such as tetrabromocyclohexane, hexabromocyclodecane and 2,4,6-tri(tribromocyclodecane) Phenoxy)-1,3,5-triazine, etc., flame retardants containing halogen components have the advantages of good flame retardancy and less addition. However, halogen products are used in product manufacturing, use, and even in recycling or It is easy to cause pollution to the environment when discarded. In addition, halogen-containing electronic equipment waste will produce corrosive and toxic gases and smoke when burned, and dioxins, dibenzofurans, etc. will be detected in the products after combustion. carcinogen

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