Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photosensitive resin composition, and photosensitive resin film and color filter using same

一种感光性树脂、组成物的技术，应用在光学、光学元件、光机械设备等方向，能够解决可靠性低、不保证充分固化、彩色滤光片的材料无法固化等问题

Active Publication Date: 2019-07-30
SAMSUNG SDI CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in general, materials used for color filters cannot be sufficiently cured by exposure, and thus need to be thermally cured by heat treatment at a high temperature of 200° C. or higher in order to obtain desired characteristics.
Therefore, materials used for color filters have the limitation that applications in e-paper, organic light-emitting diodes (OLEDs) and the like require low-temperature processes
[0003] On the other hand, it has been made by adding compounds such as epoxides, peroxides, and the like to produce materials that are required for use in electronic paper, The photosensitive resin composition of the color filter of the relatively low-temperature process of OLED and the like is an attempt to make up for the lack of curing characteristics, but it does not guarantee sufficient curing and therefore has the problem of low reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photosensitive resin composition, and photosensitive resin film and color filter using same
  • Photosensitive resin composition, and photosensitive resin film and color filter using same
  • Photosensitive resin composition, and photosensitive resin film and color filter using same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1-1

[0270] By mixing 138g of 9,9'-bis(4-glycine siloxyphenyl) fluorine (Hear Chem), 54g of 4-(methylthio)thiophenol (TCI), 1.4g of benzyl triethyl ammonium chloride (Daejung Chemicals & Metals Co.Ltd.), 1 g of triphenylphosphine (Aldrich Corporation), 128 g of propylene glycol acetate methylethylene glycol (Daejung Chemicals Daicel Chemicals Company) and 0.5 g of hydroquinone were placed in the reactor, and then the reactor was heated up to 120° C. and maintained for 12 hours to synthesize the compound represented by Chemical Formula A-1.

[0271] [Chemical formula A-1]

[0272]

Synthetic example 1-2

[0274] By adding 138g of 9,9'-bis(4-glysiloxyphenyl) fluorine (Hear Chem company), 54g of 2-(methylsulfonyl)ethane-1-thiol (TCI company), 1.4g of Benzyltriethylammonium chloride (Daejung Chemicals & Metals Co. Ltd.), 1 g of triphenylphosphine (Aldrich Corporation), 128 g of propylene glycol acetate methylethylene glycol (Daicel Chemicals Company) and 0.5 g of hydroquinone were placed in the reactor, and then the reactor was heated up to 120° C. and kept for 12 hours to synthesize the compound represented by Chemical Formula A-2 compound.

[0275] [Chemical formula A-2]

[0276]

Synthetic example 2-1

[0278] By adding 60 g of the compound represented by chemical formula A-1, 16 g of 3,3',4,4'-thiodiphthalic anhydride (American chemical Inc.), 3.4 g of 5- Norbornene-2,3-dicarboxylic anhydride (TCI Corporation), 20 g of propylene glycol methyl ethyl acetate (Daicel Chemicals Company) and 0.1 g of N,N'-tetramethyl chloride Ammonium was placed in the reactor, and then the reactor was heated up to 120° C. and maintained for 2 hours to synthesize the compound represented by Chemical Formula B-1 (weight average molecular weight: 5,600 g / mol).

[0279] [Chemical formula B-1]

[0280]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The present invention provides a photosensitive resin composition, a photosensitive resin film prepared by using the same, and a color filter comprising the photosensitive resin film, the compositioncontaining (A) a quantum dot, (B) a binder resin containing a structural unit represented by a specific chemical formula, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E)a solvent.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photosensitive resin film produced using the same, and a color filter including the photosensitive resin film. Background technique [0002] In general, a color filter applied to a display is formed by using a photosensitive resist composition, forming a desired pattern through an exposure process by using a photomask, and then dissolving and removing non-exposed regions through a developing method. Materials used for color filters may require alkali solubility, high sensitivity, adhesiveness to a substrate, chemical resistance, heat resistance, and the like. However, in general, materials used for color filters cannot be sufficiently cured by exposure, and thus need to be thermally cured by heat treatment at a high temperature greater than or equal to 200° C. in order to obtain desired characteristics. Therefore, materials used for color filters have the limitation that applicatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/105G03F7/032G03F7/027G03F7/028G03F7/16G03F7/00G02B5/22
CPCG02B5/22G03F7/032G03F7/0047G03F7/0007G02B1/04G02B5/206C08G63/672C08G63/193G03F7/027G03F7/028G03F7/105G03F7/16G02B5/223Y10S430/114Y10S430/106C08G63/6886G03F7/031G03F7/033G03F7/038G03F7/039
Inventor 郑知英李范珍姜龙熙金美善金钟基朴温柔白好贞孙秉勤柳允堤尹振燮林知泫张永雄郑暋洁韩弦周形敬熙
Owner SAMSUNG SDI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com