A preparation method of anti-adhesive mucous layer on the surface of electric knife
A mucosal layer and anti-adhesion technology, which is applied in coatings, medical science, surgery, etc., can solve the problems of poor anti-adhesion effect of small intestine tissue, and achieve the effect of ensuring hemostasis, avoiding damage to the mucosa, and low resistivity
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[0035] A preparation method of the above-mentioned anti-adhesive mucous layer, specifically comprising the following steps:
[0036] A1: make the base layer 31;
[0037] A2: Prepare a conductive layer 32 of nanoscale columnar matrix on the surface of the primer layer 31;
[0038] A3: An anti-adhesive layer 33 is provided on the top surface of the nanopillars of the conductive layer 32 to obtain an anti-adhesive mucous film layer.
[0039] Specifically, the conductive layer 32 is a mixed layer of SiO2 and nano-Ag in a nanoscale columnar matrix, and the mixed layer of SiO2 and nano-Ag is prepared by a sol-gel method.
[0040] Further, the preparation method of described SiO2 and nano-Ag mixed layer comprises the following steps:
[0041] a1: Slowly add tetraethyl orthosilicate (TEOS) dropwise to water, hydrochloric acid, NH4OH and absolute ethanol to form the precursor tetraethyl silicate;
[0042] a2: adding nano-silver paste to the precursor tetraethyl silicate to obtain a mi...
Embodiment 1
[0053] Primer layer 31: an Ag material layer with a thickness of 3 μm.
[0054] Conductive layer 32: a mixed layer of SiO2 and nano-Ag, with a thickness of 20 μm; wherein, the components of the mixed layer of SiO2 and nano-Ag are as follows: tetraethyl orthosilicate (TEOS) 12%; water 1%; HCL 1%; NH4OH 1% ; Nano-silver paste 1%; the rest is absolute ethanol.
[0055] Anti-adhesive layer 33: Ag material layer with a thickness of 0.5 μm.
[0056] The preparation of the SiO2 and nano-Ag mixed layer: 12% tetraethyl orthosilicate (TEOS) was slowly added dropwise to 1% water, 1% hydrochloric acid, 1% NH4OH and absolute ethanol to form the precursor tetraethyl silicate Ethyl ester; add 1% nano-silver paste to the precursor tetraethyl silicate to obtain a mixed solution; fully stir the mixed solution and disperse it by ultrasonic to obtain a mixed wet gel of SiO2 and nano-Ag. Wherein, the particle size of the nano silver paste is 20nm; in the step S2, the volume ratio of the nano Ag ...
Embodiment 2
[0059] Primer layer 31: an Ag material layer with a thickness of 8 μm.
[0060] Conductive layer 32: a mixed layer of SiO2 and nano-Ag, with a thickness of 5 μm; wherein, the components of the mixed layer of SiO2 and nano-Ag are as follows: tetraethyl orthosilicate (TEOS) 16%; water 0.5%; HCL 0.5%; NH4OH 0.5% ; Nano silver paste 5%; the rest is absolute ethanol.
[0061] Anti-sticking layer 33: Au material layer with a thickness of 1 μm.
[0062] The preparation of the SiO2 and nano-Ag mixed layer: 16% tetraethyl orthosilicate (TEOS) was slowly added dropwise to 0.5% water, 0.5% hydrochloric acid, 0.5% NH4OH and absolute ethanol to form the precursor tetraethyl silicate Ethyl ester; add 5% nano-silver paste to the precursor tetraethyl silicate to obtain a mixed solution; fully stir the mixed solution and disperse it by ultrasonic to obtain a mixed wet gel of SiO2 and nano-Ag. Wherein, the particle size of the nano-silver paste is 30nm; in the step S2, the volume ratio of the...
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