Packaging material applied to light-emitting diode (LED) and preparation method and using method thereof

A technology for light-emitting diodes and packaging materials, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of infiltration, decreased LED stability, insufficient protection of LED chips, etc., and achieve the effect of no surface stickiness and good resistance to yellowing.
CN101872832AActive Publication Date: 2010-10-27NICHE TECH KAISER SHANTOU
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
NICHE TECH KAISER SHANTOU
Publication Date
2010-10-27

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Abstract

The invention discloses a packaging material applied to a light-emitting diode (LED), which is characterized by consisting of a pouring sealant body and a thickening primer coating, wherein the thickening primer coating comprises the following components in part by weight: 100 parts of organic solvent; 1 to 20 parts of silicon resin; 0.1 to 30 parts of silane coupling agent and reactive group-containing siloxane and 10<-5> to 4 parts of titanate or platinum complex. In the invention, a condensate obtained after the pouring sealant body is solidified can provide good mechanical protection for the LED; the thickening primer coating has high bonding strength, can enable the pouring sealant body condensate to be adhered to a bracket of the LED reliably, and makes no space between the pouring sealant body condensate and the bracket of the LED, and the adverse influence on the LED because water vapor, oxygen and the like penetrate into the LED in the using process is prevented, so that the packaging material can protect the LED adequately.
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Description

technical field

[0001] The invention relates to a packaging material applied to light-emitting diodes (LEDs), a preparation method of the packaging material, and a use method of the packaging material for packaging light-emitting diodes. Background technique

[0002] The packaging materials of high-power light-emitting diodes (LEDs) are mainly organosilicon materials. Silicone materials have the advantages of heat resistance, weather resistance, ultraviolet light resistance, moisture resistance, etc., and their physical and chemical properties will not change after long-term use in an environment of -100 ° C to 200 ° C. It is an ideal LED packaging material.

[0003] For example, Chinese Invention Patent Application Publication Specification CN101016446A (Application No. 200710027003.4) discloses a silicone electronic potting material, which is composed of vinyl-terminated polymethylphenylsiloxane, vinylmethyl silicone resin, polymethyl Hydrogen phenyl siloxane, catalyst an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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