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High-toughness high-thermal-conductivity PBONF-based composite film and preparation method thereof

A composite film and high thermal conductivity technology, applied in the field of thermal conductive composite materials, can solve the problems of low thermal conductivity and toughness, and achieve the effects of high thermal conductivity, high heat dissipation efficiency and low density

Active Publication Date: 2019-08-09
HUNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thermal conductivity, especially the toughness, of these cellulose nanofiber-based composite films is still much lower than that of aerospace aluminum alloy materials.
[0007] Therefore, it is still a big challenge to design and prepare composite films that can replace aluminum alloys based on thermally conductive nanomaterials.

Method used

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  • High-toughness high-thermal-conductivity PBONF-based composite film and preparation method thereof
  • High-toughness high-thermal-conductivity PBONF-based composite film and preparation method thereof
  • High-toughness high-thermal-conductivity PBONF-based composite film and preparation method thereof

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preparation example Construction

[0040] The present invention also provides a preparation method of the high toughness and high thermal conductivity PBONF-based composite film described in the above technical solution, comprising the following steps:

[0041] (1) Methanesulfonic acid, trifluoroacetic acid and poly-p-phenylene benzobisoxazole micron fibers are mixed, and sodium salt is added to obtain a dispersion of sodium salt and PBONF;

[0042] (2) mixing methanesulfonic acid, trifluoroacetic acid and thermally conductive nanomaterials to obtain a dispersion of thermally conductive nanomaterials;

[0043] (3) Mix the dispersion liquid of sodium salt and PBONF in the step (1) with the dispersion liquid of the thermally conductive nanomaterial in the step (2), pour the dispersion liquid after the uniform mixing into the mould, and cover the The mold is sealed and forms a gel after standing;

[0044] (4) carry out solvent exchange with the gel of described step (3) and water, obtain high toughness and high t...

Embodiment 1

[0060] GNS / PBONF Composite Film

[0061] (1) Weigh 0.216g of commercialized poly-p-phenylenebenzobisoxazole micron fiber, add it to the mixed acid of 7mL methanesulfonic acid and 7mL trifluoroacetic acid, stir mechanically for 8h, then add 1.5g sodium sulfate to form PBONF dispersion containing sodium sulfate;

[0062] (2) Weigh 0.216g of GNS, add it into the mixed acid of 11mL methanesulfonic acid and 11mL trifluoroacetic acid, and ultrasonicate for 3h under the power of 400W to form a uniform GNS dispersion;

[0063] (3) Mix the sodium sulfate-containing PBONF dispersion prepared in step (1) with the GNS dispersion prepared in step (2), mechanically stir it for 2 hours at a speed of 1000 rpm, pour it into a flat-bottomed plastic dish with a diameter of 5.5 cm, and place it in the plastic Cover the dish with a layer of plastic wrap, and let it stand at 5°C for 8 hours to convert into a gel;

[0064] (4) Soak the gel in step (3) in distilled water, trifluoroacetic acid, meth...

Embodiment 2

[0069] Different from Example 1, the mass fraction of GNS is 40%; the thickness of the obtained PBONF-based composite film is 24 μm, and its tensile toughness is 42.4MJ / m 3 , the thermal conductivity is 87.2W / mK, and the density is 1.47g / cm 3 .

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Abstract

The invention provides a high-toughness high-thermal-conductivity PBONF-based composite film and a preparation method thereof, and belongs to the technical field of heat-conducting composite materials. The high-toughness high-thermal-conductivity PBONF-based composite film comprises PBONF and a heat-conducting nano material; the PBONF forms a three-dimensional net structure, and the heat-conducting nano material is located in the three-dimensional net structure; the PBONF is in a forked geometrical shape. The high-toughness high-thermal-conductivity PBONF-based composite film has the advantages of low density, high toughness, high thermal conductivity and the like, can replace existing aviation aluminum alloy, reduces the weight of aerospace vehicles, and meanwhile, has higher heat dissipation efficiency and excellent structural reliability.

Description

technical field [0001] The invention relates to the technical field of thermally conductive composite materials, in particular to a PBONF-based composite film with high toughness and high thermal conductivity and a preparation method thereof. Background technique [0002] With the rapid development of high-power electronic equipment for military, automotive, and aerospace vehicles towards miniaturization, integration, and high speed, electronic equipment has a large amount of heat accumulated during operation. If it is not dissipated in time, it is easy to reduce the electronic device service life, and even lead to failure of electronic devices. Therefore, the development of lightweight, high toughness, and high thermal conductivity materials is of great significance for improving the thermal management of next-generation high-power electronic devices. [0003] At present, the most widely used heat dissipation material is metal, especially aluminum alloy. This is because am...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/06C08K3/04C08K3/38C08J5/18
CPCC08J5/18C08J2379/06C08K3/041C08K3/042C08K7/24C08K2003/385C08K2201/011
Inventor 王建锋王云晶
Owner HUNAN UNIV
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