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Circuit board electroplating process

An electroplating process and circuit board technology, which is applied to the improvement of process efficiency, electrolysis process, electrolysis components, etc., can solve the problems of high price of circuit board copper plating solution and high cost of circuit board electroplating, and achieve precise control of copper ion concentration , Reduce production costs and reduce labor intensity

Active Publication Date: 2019-08-27
刘景亮
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a circuit board electroplating process to solve the current problem of high cost of circuit board electroplating due to the high price of circuit board copper plating solution

Method used

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  • Circuit board electroplating process

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preparation example Construction

[0027] The invention provides a kind of preparation method of circuit board copper plating liquid, comprises the following steps:

[0028] Providing circuit board etching solution waste as a reaction raw material, the circuit board etching solution waste is extracted, washed and back-extracted to obtain a copper sulfate solution, and the copper sulfate solution is mixed with a copper plating additive to obtain a copper plating solution, Place the circuit board in the copper plating solution for electroplating;

[0029] Wherein, in the process of electroplating, the copper ion concentration in the copper ion concentration control system is used to detect the copper ion concentration in the copper plating solution, and the stirring speed of the extraction system in the extraction process is adjusted according to the detection result, so that the copper ion concentration in the copper plating solution meets the requirements of the circuit. Board copper plating requirements.

[0...

Embodiment 1

[0047] This embodiment is an electroplating process of a circuit board, and its process flow chart is as follows figure 1 As shown, specifically, the electroplating process includes the following steps:

[0048] S1) Provide circuit board etching liquid waste as the reaction raw material, circuit board etching liquid waste enters the extraction tank and reacts with the extractant to obtain the copper-loaded extractant and raffinate, wherein adding components to the raffinate is the preparation The ammonium chloride and liquid ammonia of the agent, after the raffinate is prepared, enter the etching machine as an alkaline etching solution, and then recirculate to the extraction tank for extraction;

[0049] S2) The loaded copper extractant obtained after the extraction is washed with water and enters the stripping tank for stripping, and the copper sulfate solution and the extractant are obtained after stripping, and the copper sulfate solution is mixed with the copper plating ad...

Embodiment 2

[0056] This embodiment is a circuit board hole-filling copper plating process, and its technological process is the same as that of Embodiment 1, the difference being that the concentration of the circuit board copper plating solution prepared in this embodiment is 45 grams per liter, set The copper ion concentration of the copper plating solution is close to the lower control limit of 40 g / L, and the upper control limit is 50 g / L. When the concentration of copper ions in the detected copper plating solution was close to the lower limit of control, the copper ion concentration control system gave a signal to the extraction system to increase the stirring speed of the extraction system to 220 rpm. When the ion concentration is close to the control upper limit, the copper ion concentration control system sends a signal to the extraction system to reduce the stirring speed of the extraction system to 180 rpm.

[0057] It is calculated that the electroplating cost of the electropl...

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Abstract

The invention provides a circuit board electroplating process and relates to the field of electroplating. The circuit board electroplating process comprises the following steps of providing a circuitboard etching waste solution as a reaction raw material, conducting extraction, water washing and reverse extraction on the circuit board etching waste solution to obtain a copper sulfate solution, mixing the copper sulfate solution and a copper plating additive to obtain a copper plating solution, and putting circuit boards in the copper plating additive to be subjected to electroplating, whereinin the electroplating process, a system is controlled to detect the concentration of copper ions in the copper plating solution according to the concentration of the copper ions; the stirring rate ofan extraction system is regulated according to a detection result to enable the concentration of the copper ions in the copper plating solution to meet the requirements for copper plating on circuitboards. Through the electroplating process, the problem that the electroplating cost of circuit boards remains high at present is solved. The electroplating cost of the circuit boards is reduced.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an electroplating process for a circuit board. Background technique [0002] The electroplating solution containing copper sulfate plays an extremely important role in the electroplating of PCB circuit boards. The quality of the electroplating solution directly affects the quality and related mechanical properties of the electroplated copper layer, and has a certain impact on subsequent processing. Only when the thickness of the coating on the surface of the circuit board and in the hole is uniform, can the coating have sufficient strength and conductivity. This requires that the plating solution has good dispersibility and deep plating ability. With the development of printed boards towards high density and high precision, higher requirements are put forward for the electroplating solution. [0003] The existing circuit board copper plating solution is provided by two methods: on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/14C25D7/00C25D3/38C22B7/00C22B15/00
CPCC22B7/006C22B15/0086C25D3/38C25D7/00C25D21/14Y02P10/20
Inventor 刘景亮刘镭
Owner 刘景亮