A Mechatronic Smart Backplane Satellite Architecture

A satellite configuration and intelligent technology, applied in electrical components, computer control, radio transmission systems, etc., can solve problems such as the inability to ensure the balance of pressure inside and outside the cabin, the lack of synergy of the control system, and the lack of honeycomb structure for the intelligent backplane. To achieve the effect of simplifying the satellite commissioning and testing process, solving the problem of thermal engine fatigue, and reducing the phenomenon of mechanical stress

Active Publication Date: 2022-02-01
SHANDONG INST OF AEROSPACE ELECTRONICS TECH +1
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Problems solved by technology

However, most of the existing technologies do not mention the use of the electronic control system in the smart backboard for circuit control, and there are smart backboards that do not use a honeycomb structure, which cannot ensure the balance of pressure inside and outside the cabin, and the synergy of the control system is not strong. technical problem

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  • A Mechatronic Smart Backplane Satellite Architecture
  • A Mechatronic Smart Backplane Satellite Architecture
  • A Mechatronic Smart Backplane Satellite Architecture

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Embodiment Construction

[0073] The present invention will be described below in conjunction with the accompanying drawings and specific embodiments.

[0074] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some, not all, embodiments of the present invention.

[0075] Therefore, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the claimed invention, but merely represents some embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0076] It should be noted that like numerals and...

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Abstract

The invention discloses a mechatronic intelligent backplane satellite structure, including an intelligent backplane, which adopts a sandwich structure, including an upper honeycomb panel, a middle honeycomb panel and a lower honeycomb panel, and adopts different forms of backplane connectors between them Connected together by bolts; the electronic equipment in the board is installed in the installation groove set in the middle honeycomb board, there is a wiring groove between the installation grooves, and the cables between the electronic equipment in the board are routed through the wiring groove; the upper and lower honeycomb The board and the middle honeycomb board are connected by glue; the electronic equipment in the board is made of MCM multifunctional structure or single-board PCB, and the parts of the electronic equipment in the board are connected by power lines, cables, and optical fibers. The invention eliminates large-volume components and integrates sub-systems such as data transmission and power distribution networks, and embeds electronic equipment into composite materials to form a mechatronic intelligent backplane. The satellite system is light in weight, simple in assembly, and convenient and fast in testing and debugging. .

Description

technical field [0001] The invention relates to aerospace, optics, machinery, electronics, information processing, etc., belongs to the practical technical field of satellite products, and in particular relates to a mechatronics intelligent backplane satellite architecture. Background technique [0002] In traditional spacecraft, the structural function, thermal control function and electronic function are independent design units; The functional units are assembled together with screws during the final assembly of the spacecraft. The power distribution and signal transmission between the units are realized through connectors and bundled cables. These cables and connectors are mainly composed of a large number of volume packages. They do not have electronic functions but It only provides structural support and allows debugging during assembly and testing; however, this design scheme is difficult to meet the development needs of future spacecraft for light weight, miniaturiza...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/042H04B7/185
CPCG05B19/042H04B7/18502
Inventor 石德乐宋镇江常中坤徐波王凯明
Owner SHANDONG INST OF AEROSPACE ELECTRONICS TECH
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