Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method for environmentally-friendly glass paste

A glass paste, environmentally friendly technology, used in quartz/glass/glass enamel, electrical components, circuits, etc., can solve the problems of poor bonding strength and sealing performance, easy drying of glass paste, and high printing process requirements. Good insulation and good flatness

Inactive Publication Date: 2019-09-10
JIANGSU UNIV
View PDF13 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First, the glass powder is fired by the traditional process, and then various organic carriers are added in a water bath, and then stirred, mixed, and rolled to form a glass paste; then printed, using infrared to remove moisture, and sintered into shape, this method Although the prepared glass paste has a slightly lower sintering temperature and does not contain lead elements, its bonding strength and sealing performance are poor
Chinese invention patent CN201410587634 uses the traditional glass powder formula, adds light-absorbing materials and traditional organic carriers in the process of configuring the slurry, and then prints and uses laser heating to heat the coated slurry to achieve sealing. The purpose of connecting electronic products. Although the glass paste prepared by this method improves the efficiency of laser heating and sintering and has certain thermal shock resistance, its own bonding strength is not ideal, and the bonding thickness cannot be controlled. The pattern is not easy to finalize
Chinese invention patent CN200780046484 discloses a method for configuring glass paste containing adhesive resin components, which has excellent compatibility at low temperature and excellent low-temperature sinterability, and is not easy to cause partition damage. Traditional glass frits such as Bi-B-Si are used. , and the traditional glass paste configuration method, mainly adding methacrylate monomers, which makes the glass paste better meet the requirements of printing and bonding, but the glass paste is easy to dry after printing, which is harmful to printing higher process requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method for environmentally-friendly glass paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment example 1

[0022] Step 1: Calculate by weight percentage, Bi 2 o 3 50wt.%, B 2 o 3 20wt.%, SiO 2 20wt.%, ZnO3wt.%, Al 2 o 3 3wt.%, TiO 2 4wt.% was simply physically mixed, melted at a temperature of 1200°C, kept warm for 60 minutes, and then quickly put into deionized water for water quenching and cooling to obtain cooled and solidified glass slag. Put the glass slag into a ball mill (using agate balls) for wet grinding and crushing. The mass ratio of the material to the ball is large ball (R=10mm): medium ball (R=7mm): small ball (R=3mm): glass slag =1:2:2:1, ball milling time is 24h. After ball milling, the material was dried in an oven at 60 °C for 12 h. Finally, use a 200 sieve to sieve to obtain glass powder with a particle size of 0.5 μm to 8 μm.

[0023] Step 2: the configuration of the organic carrier: by weight percentage, 10wt.% ethyl cellulose resin is added to 45wt.% butyl carbitol and 45wt.% butyl carbitol acetate solvent, in a constant temperature water tank, ...

Embodiment example 2

[0032] Step 1: Calculate by weight percentage, Bi 2 o 3 60wt.%, B 2 o 3 15wt.%, SiO 2 10wt.%, ZnO10wt.%, Al 2 o 3 3wt.%, TiO 2 2wt.% after simple physical mixing, melted at a temperature of 1300°C, kept for 40 minutes, and then quickly put into deionized water for water quenching and cooling to obtain cooled and solidified glass slag. Put the glass slag into a ball mill (using agate balls) for wet grinding and crushing, the mass ratio of the material to the ball is large ball (R=10mm): medium ball (R=7mm): small ball (R=3mm): glass slag =1:2:2:1, ball milling time is 20h. After ball milling, the material was dried in an oven at 70°C for 10 h. Finally, use a 200 sieve to sieve to obtain glass powder with a particle size of 0.5 μm to 8 μm.

[0033] Step 2: Configuration of organic solvent: Calculated by weight percentage, add 7wt.% ethyl cellulose resin to 93wt.% terpineol solvent, dissolve completely in a constant temperature water tank at a temperature of 80° C., a...

Embodiment example 3

[0042] Step 1: Calculate by weight percentage, Bi 2 o 3 70wt.%, B 2 o 3 12wt.%, SiO 2 5wt.%, ZnO10wt.%, Al 2 o 3 2wt.%, TiO 2 After simple physical mixing of 1wt.%, melt at a temperature of 1300°C, keep it warm for 30 minutes, and then quickly put it into deionized water for water quenching and cooling to obtain cooled and solidified glass slag. Put the glass slag into a ball mill (using agate balls) for wet grinding and crushing, the mass ratio of the material to the ball is large ball (R=10mm): medium ball (R=7mm): small ball (R=3mm): glass slag =1:2:2:1, ball milling time is 18h. After ball milling, the material was dried in an oven at 80 °C for 8 h. Finally, sieve with a 300 sieve to obtain glass powder with a particle size of 0.5 μm to 5 μm.

[0043] Step 2: Configuration of organic solvent: Calculated by weight percentage, add 5wt.% ethyl cellulose resin to 50wt.% terpineol solvent and 45wt.% butyl carbitol solvent, in a constant temperature water tank at a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
hardnessaaaaaaaaaa
hardnessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the field of sealing materials, specifically to a sealing glass paste, and specifically to a preparation method for an environmentally-friendly glass paste. According to the invention, through designing of a proper glass system, an organic carrier and a solvent, the phenomenons of bubbles and pinholes probably generated in sintering and the problems like acid resistance ofa product after sintering are improved; through changing of the addition proportion of glass powder, the insulation property, printing thickness and printing property of the product can be adjusted,and the viscosity of the product is adjusted at the same time; through changing the proportion of a thickener, the viscosity and printing property of the product can be changed; and through changing of the addition proportion of a thixotropic agent, the thixotropy, printing thickness and printing property of the product can be adjusted. The environmentally-friendly glass paste provided by the invention can be used for medium-and-low-temperature welding at 500 DEG C to 680 DEG C to obtain a pollution-free and environmentally-friendly glass solder with good flatness and good insulation propertyand used for device sealing.

Description

technical field [0001] The invention relates to the field of sealing materials, in particular to a sealing glass paste, in particular to a preparation method of an environment-friendly glass paste. Background technique [0002] To prepare electronic devices and make them work stably, the electronic devices need to be packaged with sealing glass paste in the later stage; especially when packaging capacitor devices, the paste needs to be able to control the spacing of the cavities. The commonly used sealing materials are mainly glass materials, and the packaging process mainly includes: 1) making the glass material into glass powder and then making glass paste; 2) printing the glass paste on the sealing part; 3) removing the paste by heating The carrier material and melt the glass material to seal the device. [0003] However, in the actual production process, the control of the capacitor spacing is accomplished by methods such as silicon-silicon bonding or etching, which are...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24C03C12/00H01B3/08H01B19/00
CPCC03C8/24C03C12/00H01B3/087H01B19/00
Inventor 邵海成刘炘城乔冠军黄清伟刘桂武张相召
Owner JIANGSU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com