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Mixed metal powder for imbricated conductive adhesive and preparation method of mixed metal powder for imbricated conductive adhesive

A technology of mixing metal and conductive adhesive, which is applied in the field of metal powder processing, can solve the problems of high price of pure silver shingled conductive adhesive and easy oxidation of silver-clad copper shingled conductive adhesive, and achieve good conductivity, not easy to oxidize, and reduce cost effect

Active Publication Date: 2019-09-27
湖南省国银新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a mixed metal powder for shingling conductive adhesive and a preparation method thereof, which is used to overcome the defects in the prior art that the pure silver shingling conductive adhesive is expensive, and the silver-clad copper shingling conductive adhesive is easy to oxidize, and realizes The preparation and use cost of the shingled conductive adhesive obtained by using the mixed metal powder provided by the invention is low, and it is not easy to produce oxidation

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  • Mixed metal powder for imbricated conductive adhesive and preparation method of mixed metal powder for imbricated conductive adhesive

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preparation example Construction

[0019] The present invention also provides a method for preparing mixed metal powder for shingled conductive adhesive, comprising the following steps:

[0020] S1: by weight percentage (6~85): (10~90): (0.1~10) Weigh flake silver powder, metal hydride and zinc sulfate, and mix them evenly to obtain a metal mixture; The metal powder has low preparation cost and excellent electrical conductivity, and can better overcome the problems of silver migration and oxidation caused by the use of pure silver powder in the prior art.

[0021] Preferably, the purity of the flake silver powder, metal hydride and zinc sulfate are all ≥99%, and the high-purity raw material can ensure that the final product has a low impurity content, so that the performance is more excellent.

[0022] Preferably, the average particle size of the flake silver powder is 0.3-10 μm, and the particle size of the silver powder is too large, which will make it difficult to chemically deposit or coat the surface of me...

Embodiment 1

[0033] This embodiment provides a mixed metal powder for shingled conductive adhesive, the mixed metal powder is composed of silver powder, metal hydride and zinc sulfate, and the silver powder content is 74.89%; the average particle size of the mixed metal powder is 5 μm .

[0034] The present embodiment also provides a method for preparing mixed metal powder for shingled conductive adhesive, comprising the following steps:

[0035] S1: take by weighing 12 kilograms of silver powder, 3 kilograms of bismuth hydride and 1 kilogram of zinc sulfate, mix well to obtain a metal mixture;

[0036] S2: add 8 kilograms of terpineol to the metal mixture, then add 0.5 kilograms of resin L (Hunan Unico Chemical Technology Co., Ltd.) and 16 kilograms of zirconia beads (particle size is 1mm), carry out sand grinding 30min, obtain the mixture liquid;

[0037] S3: filter the mixed liquid and dry at 60° C. for 30 minutes to obtain mixed metal powder for shingled conductive adhesive.

Embodiment 2

[0039]This embodiment provides a mixed metal powder for shingled conductive adhesive, the mixed metal powder is composed of silver powder, metal hydride and zinc sulfate, and the silver powder content is 83.81%; the average particle size of the mixed metal powder is 6 μm .

[0040] The present embodiment also provides a method for preparing mixed metal powder for shingled conductive adhesive, comprising the following steps:

[0041] S1: take by weighing 13 kilograms of silver powder, 2 kilograms of titanium hydride and 0.5 kilograms of zinc sulfate, mix well to obtain a metal mixture;

[0042] S2: add 15 kilograms of terpineol to the metal mixture, then add 0.2 kilograms of resin L (Hunan Unico Chemical Technology Co., Ltd.), 0.55 kilograms of butyl butyrate and 50 kilograms of zirconia beads (0.6mm), and carry out sand grinding 5min to obtain the mixed material liquid;

[0043] S3: filter the mixed liquid and dry at 70° C. for 20 min to obtain mixed metal powder for shingle...

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Abstract

The invention discloses mixed metal powder for imbricated conductive adhesive and a preparation method of the mixed metal powder for the imbricated conductive adhesive. The mixed metal powder is mainly composed of flaky silver powder, metal hydride and zinc sulfate, wherein the zinc sulfate is filled in gaps where the surface of the metal hydride is not completely deposited and coated with the flaky silver powder, the content of the flaky silver powder is 4.95%-89.94%, and the average particle size of the mixed metal powder is 0.1-20 microns; and the preparation method comprises the following steps that the flaky silver powder, the metal hydride and the zinc sulfate raw materials are weighed in proportion and are mixed, the terpilenol, a coating agent and grinding beads are added, and sanding, filtering and drying are carried out to obtain the mixed metal powder for the imbricated conductive adhesive. According to the metal powder and the preparation method, the preparation method is simple in process, the production period can be shortened by adopting the sanding, so that the production cost is reduced, and mass production can be realized; the silver content of the mixed metal powder is reduced, so that the silver migration phenomenon caused by existing pure silver powder can be overcome while the cost is reduced; and in addition, the defect that the existing silver-clad copper imbricated conductive adhesive is easy to oxidize is overcome.

Description

technical field [0001] The invention relates to the technical field of metal powder processing, in particular to a mixed metal powder used for shingled conductive adhesive and a preparation method thereof. Background technique [0002] With the technological development of modules in the photovoltaic industry, new photovoltaic modules represented by shingled technology are increasingly recognized by the market. At the same time, the technology of shingled conductive adhesive, a key material for photovoltaic shingled modules, has also been developed rapidly. The traditional conductive powder for shingled conductive adhesive is generally silver powder or silver-coated copper powder. The shingled conductive adhesive using silver powder is expensive, and pure silver powder is prone to the effect of silver migration, resulting in slightly insufficient overall performance in terms of weather resistance. Although the cost of shingled conductive adhesive using silver-coated copper ...

Claims

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Application Information

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IPC IPC(8): B22F1/02B22F1/00H01L31/0224H01L31/05
CPCH01L31/022425H01L31/0512B22F1/05B22F1/068B22F1/17Y02E10/50
Inventor 刘宵杨华荣严红革李蓉李锦如陈吉华
Owner 湖南省国银新材料有限公司
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