Cluster magneto-rheological grinding and polishing device and use method thereof

Abstract

The invention discloses a cluster magneto-rheological grinding and polishing device. The cluster magneto-rheological grinding and polishing device comprises a polishing disc, at least one magnet assembly arranged below the polishing disc, a magnetic pole drive device and a supporting device. At least one groove is formed in the bottom face of the polishing disc, polishing adsorption pads are arranged in the grooves, and each polishing adsorption pad is provided with at least one workpiece bearing groove. A cavity for containing magneto-rheological polishing liquid is formed by the side wall and the bottom face of the polishing disc. Abrasive materials of the magneto-rheological polishing liquid comprise nano abrasive material particles, a binding agent and micro magnetic particles, and the nano abrasive material particles wrap the outer surfaces of the micro magnetic particles under the effect of the binding agent. Each magnet assembly comprises at least two magnets arranged according to a preset rule, so that a flexible polishing pad formed by the magneto-rheological polishing liquid completely covers the surfaces of workpieces. The magnetic pole drive device is connected with the magnet assemblies and used for driving the magnet assemblies to carry out auto-rotation and revolution. The polishing disc is arranged on the supporting device in a height-adjustable manner. The invention further discloses a use method of the cluster magneto-rheological grinding and polishing device.

Description

technical field [0001] The invention relates to the technical field of polishing equipment, in particular to a cluster magnetorheological grinding and polishing device. In addition, the present invention also relates to a method for using the cluster magnetorheological grinding and polishing device. Background technique [0002] In the technical fields of optical components, semiconductor wafers, LED substrates and liquid crystal display panels, magnetorheological polishing technology is usually used to polish workpieces to meet the planarization requirements of optical components and semiconductor substrates. [0003] The magnetorheological polishing technology has a good polishing effect and will not cause subsurface damage to the surface of the workpiece, and is especially suitable for ultra-precision machining of hard and brittle materials. [0004] The principle of cluster magnetorheological polishing is: based on the magnetorheological effect, abrasive particles are a...

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Problems solved by technology

[0006] However, the cluster magnetorheological grinding and polishing device in the prior art needs the polishing disc to hold the magnetorheological polishing working fluid, and also needs the spindle of the polishing head and the clamping device to realize the clamping of the workpiece, so as to To ensure the position of the workpiece relative to the magnetorheological polishing working fluid, the structure is complex

At the same time, since the workpiece is set on the spindle of the polishing head, it is necessary to adjust the height of the spindle to ensure that the lower surface of the workpiece is in contact with the top of the magnetorheological micro-grinding head, and the operation of adjusting the spindle is inconvenient

Furthermore, during the machining process, while the spindle rotates, the polishing disc moves synchronously, the motion control is complex and the machine mechanism is huge, and the cost is high.

In addition, since the formed magnetorheological microgrinding head has a "mountain-shaped" structure, that is, the top area of ​​the magnetorheological microgrinding head is the smallest, therefore, the top of the magnetorheological microgrinding head is used to microcut and polish the workpiece. Small area, low abrasive utilization and polishing efficiency

In addition, due to the repulsive behavior of magnetic particles in the magnetorheological polishing fluid, a large amount of magnetic particles accumulate on the side of the flexible polishing pad close to the magnet, while a large amount of abrasive particles accumulate on the end away from the magnet, the processing efficiency is not high and uniform processing cannot be guaranteed sex

Finally, the abrasive grains of the magnetorheological polishing working fluid escape from the processing area under the action of centrifugal force and cutting force to realize the abrasive self-sharpening. The abrasive grain renewal rate of the magnetorheological polishing working fluid in this structure is slow and the utilization rate is low Low

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