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Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

A technology of substrate processing apparatus and recording medium, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, transportation and packaging, etc., can solve problems such as reduction in productivity, achieve suppression of reduction in productivity and realize process reproduction sexual effect

Pending Publication Date: 2019-10-01
KOKUSA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the conventional processing using electromagnetic waves, it is necessary to install a cooling process in the processing chamber to cool the substrate heated at a high temperature by the heat processing, so the productivity may decrease.

Method used

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  • Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
  • Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
  • Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Examples

Experimental program
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Effect test

Embodiment 1

[0024] (1) Structure of substrate processing equipment

[0025] The substrate processing apparatus 100 according to the first embodiment is configured as a single-wafer heat treatment apparatus for performing various heat treatments on one or a plurality of wafers, and is used as an apparatus for performing annealing treatment (modification treatment) using electromagnetic waves to be described later. Be explained. In the substrate processing apparatus 100 of this embodiment, a FOUP (Front Opening Unified Pod: hereinafter referred to as a wafer cassette) 110 is used as a storage container (carrier) in which a wafer 200 of a substrate is accommodated. The cassette 110 can also be used as a transport container for transporting the wafer 200 between various substrate processing apparatuses.

[0026] Such as figure 1 and figure 2 As shown, the substrate processing apparatus 100 includes: a transfer housing 202 having a transfer chamber 203 for transferring a wafer 200 inside; ...

Embodiment 2

[0104] In the second embodiment, in the substrate unloading process (S806) of the substrate processing apparatus described in the first embodiment, not only the unloading of the substrate but also the position correction of the susceptor, unloading of the processed substrate, and loading of the unprocessed substrate are performed. Examples of substrate processing apparatuses such as That is, the present embodiment includes a processing chamber for processing a substrate, an electromagnetic wave supply unit for supplying electromagnetic waves to the substrate, a substrate holding unit for holding the substrate and a susceptor for suppressing absorption of electromagnetic waves by the edge of the substrate, a substrate transport unit for transporting the substrate, An embodiment of the substrate processing apparatus configured as a control unit for correcting the position of the susceptor by the substrate transfer unit.

[0105] described in Example 1 Figure 7 In the flowchart...

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PUM

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Abstract

The invention relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, and a recording medium. Influence on process reproducibility caused by position change of asusceptor of the substrate processing apparatus or the like is eliminated. According to one aspect of technique described herein, there is provided a technique including; a process chamber in which the substrate is processed; an electromagnetic wave supply part configured to supply an electromagnetic wave to the substrate; a substrate holding part configured to hold the substrate and the susceptor for suppressing the electromagnetic wave from being adsorbed to an edge of the substrate; a substrate transfer part configured to transfer the substrate; and a controller configured to control the substrate transfer part so as to correct a position of the susceptor.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, a manufacturing method of a semiconductor device, and a recording medium. Background technique [0002] As one step in the manufacturing process of a semiconductor device (semiconductor device), there is, for example, a modification treatment typified by annealing treatment, which uses a heating device to heat the substrate in the processing chamber to make the thin film formed on the surface of the substrate The composition and crystal structure of the film change, or the crystal defects in the formed film are repaired. In recent semiconductor devices, miniaturization and high integration have become remarkable, and along with this, modification processing for high-density substrates on which patterns having high aspect ratios have been formed is required. As such a modification treatment method for a high-density substrate, for example, a heat treatment method using electromagnetic w...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677H01L21/324
CPCH01L21/67098H01L21/324H01L21/67739H01L21/67748H01L21/67766H01L21/67259H01L21/68H01L21/67742H01L21/683H01L21/50H01L21/67115H01L22/20H01L21/2686H01L21/68707
Inventor 广地志有
Owner KOKUSA ELECTRIC CO LTD
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