Space optical waveguide fabrication method

Abstract

The invention discloses a space optical waveguide fabrication method. The method comprises the steps of coating photoresist among to-be-connected optical opening carriers, identifying and designing aconnection path, and achieving fabrication of a space optical waveguide by the space optical waveguide comprising a support structure, fabricated by spiral irradiation of the photoresist for many times, and the photoresist wrapped with the cured support structure. According to the space optical waveguide fabrication method, the polymerization and crosslinking reaction of the photoresist is facilitated and the photoresist is cured by a non-linear absorption effect of the photoresist on irradiation light energy, the diffraction limit can be broken through, the processing of the space optical waveguide with an arbitrary three-dimensional form and processing resolution smaller than 100 nanometers achieved, thus, matching of the three-dimensional form of the space optical waveguide and the sizes of the to-be-connected optical openings can be achieved, the loss during the optical waveguide coupling process is reduced, the intensity of the space optical waveguide is improved by the spirally-processed support structure, and interconnection of high-quality large-distance devices is achieved.

Description

technical field [0001] The present application relates to the technical field of optical communication, and more specifically, relates to a preparation method of a spatial optical waveguide. Background technique [0002] With the rapid development of the optical communication industry, in recent years, the successive introduction of 4G and 5G communication technologies is inseparable from the rapid development of integrated optics, especially silicon photonics. The connection between chips and chip-integrated optical waveguides, and the connection technology between chip-integrated optical waveguides and optical fibers have become research hotspots, and have also become key factors restricting the development of integrated optical circuits. [0003] The existing technology solves the coupling connection between chips by using coupler pattern conversion and matching. The specific connection method is: chip 1→coupler 1→optical fiber→coupler 2→chip 2. Usually, lens coupler and ...

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Problems solved by technology

[0004] The existing technology uses optical fiber to realize the connection between two chip-integrated optical waveguides. The size of the optical opening on the chip integration is less than 1 micron (the optical opening refers to the connection section of the optical waveguide on the carrier), and the core diameter of the single-mode optical fiber is about 8-10 microns, the direct connection loss is as high as more than 99%. Usually, a coupler is used to match the chip optical waveguide mode spot with the fiber mode spot. Even in this way, the coupling connection loss is higher than 50%. The existing technical solutions cannot realize chip integration. Low-loss connection between optical waveguides

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