Unlock instant, AI-driven research and patent intelligence for your innovation.

A process for preparing thermally conductive polymer materials by using sls to form porous ceramic thermally conductive networks

A technology of thermally conductive polymers and porous ceramics, which is applied in the fields of automobile manufacturing, aerospace, and polymer materials. It can solve problems such as low thermal conductivity, pores, and reduced thermal conductivity, and achieve good toughness and rigidity. Good thermal conductivity, Realize the effect of alienation

Active Publication Date: 2022-04-19
OECHSLER PLASTIC PROD TAICANG +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although these two types of methods in the prior art can effectively construct a heat conduction network, the fillers that form the heat conduction network only rely on external pressure to gather together, lacking the connection of binding forces (such as intermolecular forces, chemical bonds, etc.) , it will inevitably lead to a decrease in the mechanical properties of the material, and there are pores between the fillers, which will reduce the thermal conductivity
[0004] The thermal conductivity of commercially available thermal resins is mostly around 1W / (mK), which is far from the actual application requirements.
Moreover, due to the high addition amount, the mechanical properties and processing properties of the product are reduced, and it cannot be used in extreme environments.
[0005] The Chinese patent application number is CN201811469670.2, which discloses a preparation method of hexagonal boron nitride / epoxy resin composite material with high thermal conductivity, using hexagonal boron nitride and epoxy resin as raw materials, through solvent dispersion, vacuum filtration, Sheeting treatment and curing treatment to prepare high thermal conductivity hexagonal boron nitride / epoxy resin composite material, the process is complex, only rely on external pressure to gather together, lack of bonding force, will lead to decline in mechanical properties of the material, and there are pores between the fillers, reduce thermal conductivity
[0006] Chinese patent application number CN201811004019.8 discloses a preparation method of boron nitride / epoxy resin composite material with a three-dimensional structure, the process is complicated and the thermal conductivity is not high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A process for preparing thermally conductive polymer materials by using sls to form porous ceramic thermally conductive networks
  • A process for preparing thermally conductive polymer materials by using sls to form porous ceramic thermally conductive networks

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] (1) Use a plastic measuring cup to measure boron nitride powder and PA12 powder, the volume ratio is 1:1, and mix them with a high-speed mixer for 20 minutes.

[0045](2) Import the designed integrated filler structure into the software, set the process parameters of SLS, the mold cavity temperature is 150°C, the printing surface temperature is 150°C, the laser power is 10W, and the scanning speed is 600mm / s, and then Print and shape.

[0046] (3) Spray the epichlorohydrin solution on the obtained porous ceramic heat-conducting network for 3 to 5 times, and dry at 120°C. Place the dried porous ceramic heat conduction network in a muffle furnace, raise the temperature from room temperature to 400°C at a rate of 10°C / min, keep it warm for 30 minutes, then raise the temperature from 400°C to 900°C at a rate of 10°C / min, and keep it warm After 10 minutes, cool naturally.

[0047] (4) After weighing 45wt% of bisphenol A epoxy resin, 25wt% of phenolic resin, 20wt% of curing...

Embodiment 2

[0049] (1) Use a plastic measuring cup to measure boron nitride powder and PA12 powder, the volume ratio is 1:1.5, and mix them with a high-speed mixer for 20 minutes.

[0050] (2) Import the designed integrated filler structure into the software, set the process parameters of SLS, the mold cavity temperature is 155°C, the printing surface temperature is 160°C, the laser power is 12W, the scanning speed is 600mm / s, and then Print and shape.

[0051] (3) Spray the epichlorohydrin solution on the obtained porous ceramic heat-conducting network for 3 to 5 times, and dry at 120°C. Place the dried porous ceramic heat conduction network in a muffle furnace, raise the temperature from room temperature to 400°C at a rate of 10°C / min, keep it for 40 minutes, then raise the temperature from 400°C to 1000°C at a rate of 20°C / min, and keep it warm After 10 minutes, cool naturally.

[0052] (4) After weighing 48wt% of bisphenol A epoxy resin, 22wt% of phenolic resin, 20wt% of curing agen...

Embodiment 3

[0054] (1) Use a plastic measuring cup to measure boron nitride powder and PA12 powder, the volume ratio is 1:2, and mix them with a high-speed mixer for 30 minutes.

[0055] (2) Import the designed integrated packing structure into the software, set the process parameters of SLS, the mold cavity temperature is 160°C, the printing surface temperature is 160°C, the laser power is 14W, the scanning speed is 650mm / s, and then Print and shape.

[0056] (3) Spray the epichlorohydrin solution on the obtained porous ceramic heat-conducting network for 3 to 5 times, and dry at 120°C. Place the dried porous ceramic heat conduction network in a muffle furnace, raise the temperature from room temperature to 400°C at a rate of 10°C / min, keep it for 40 minutes, then raise the temperature from 400°C to 1100°C at a rate of 20°C / min, and keep it warm After 10 minutes, cool naturally.

[0057] (4) After weighing 50wt% of bisphenol A epoxy resin, 20wt% of phenolic resin, 20wt% of curing agent...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
specific surface areaaaaaaaaaaa
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A process for preparing a heat-conducting polymer material by using SLS to form a porous ceramic heat-conducting network, including the following steps: blending ceramic powder and powder; importing the designed integrated filler structure into the software, setting the process parameters of SLS, The mixed powder is printed and formed; the obtained porous ceramic heat conduction network is sprayed with epichlorohydrin solution and then dried; the dried porous ceramic heat conduction network is placed in a muffle furnace, and after heating, it is naturally cooled; the cooled The porous ceramic heat conduction network is filled into the thermosetting resin matrix, and the heat conduction polymer material is obtained by prepreg-vacuum curing process. The process for preparing heat-conducting polymer materials using SLS to form porous ceramic heat-conducting networks described in the present invention has simple process and high flexibility, and the prepared heat-conducting polymer materials have extremely high thermal conductivity, ultra-high strength, and good Toughness and rigidity, broad application prospects.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a process for preparing a heat-conducting polymer material by using SLS to form a porous ceramic heat-conducting network, in particular to a process for preparing a heat-conducting polymer material by using SLS to form a porous ceramic heat-conducting network, which is applied in the fields of automobile manufacturing and aerospace Process of polymer materials. Background technique [0002] The research direction of polymer thermal conductivity modification is divided into two categories, one is to improve the overall thermal conductivity by adding fillers with better thermal conductivity, and the other is to optimize the dispersion form of fillers in the matrix to reduce the "threshold" , to improve the formation efficiency of three-dimensional heat conduction pathways. At present, the exploration of high thermal conductivity fillers has been relatively ma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L61/06C08K3/38C08J5/24
CPCC08J5/24C08J2363/00C08J2461/06C08K2003/385
Inventor 胡焕波吴唯黄建昌袁月刘冬梅王懿
Owner OECHSLER PLASTIC PROD TAICANG