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Anisotropic insulating and heat-conducting composition and preparation method thereof

An insulating heat-conducting and anisotropic technology, which is applied in the field of anisotropic insulating and heat-conducting compositions and their preparation, can solve the problems of not paying attention to the physical properties of the cured product, complicated production methods of heat-conducting sheets, unfavorable large-scale continuous production, and the like. Conducive to large-scale continuous production, improved physical properties, and simple operation

Inactive Publication Date: 2019-10-18
SHENZHEN FRD SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Patent CN107995999A discloses a heat conduction sheet, which mentions that carbon fibers are oriented and combined with thermally conductive fillers to achieve high thermal conductivity. However, due to the electrical conductivity of carbon fibers, there are many restrictions in application, and the production of heat conduction sheets in this patent The method is too complicated, which is not conducive to large-scale continuous production, and there is no attention to the physical properties of the cured product

Method used

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  • Anisotropic insulating and heat-conducting composition and preparation method thereof
  • Anisotropic insulating and heat-conducting composition and preparation method thereof

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preparation example Construction

[0036] The preparation method of the anisotropic insulating and heat-conducting composition of the present invention may comprise the following steps:

[0037] S1. Mix the raw materials in parts by mass to form a mixture.

[0038] S2, extruding the mixture into sheets through an extruder.

[0039] Wherein, the length of the extrusion chamber of the extruder is 0.5cm-50cm, preferably 2cm-10cm; the length of the extrusion chamber is less than 2cm and the degree of orientation is insufficient, and it is difficult to extrude if the length of the extrusion chamber is less than 2cm. The width of the extrusion cavity is 0.1mm-50mm. Preferably 1cm-5cm; if the width of the extrusion cavity is less than 1cm, the size of the finished product will be too small, and if it is greater than 5cm, it will be difficult to extrude a complete sheet. The thickness of the extrusion cavity is 0.1mm-10mm, preferably 0.3mm-2mm; if the thickness of the extrusion cavity is less than 0.3mm, it will make...

Embodiment 1

[0048] 600g of long-chain polydimethylsiloxane with an average molecular weight of 500,000, 200g of terminal vinyl dimethylsiloxane with an average molecular weight of 1000, 200g of polydimethylsiloxane with an average molecular weight of 1000 Add it into a 2L kneader, knead and stir for 5 minutes at room temperature, and then add 1000g of flake boron nitride powder with an average particle size of 25μm, 500g of spherical alumina powder with an average particle size of 3μm, and 500g of 2μm spherical alumina powder, 200g BET method specific surface area is 200m 2 / g of fumed silica, mixed at room temperature for 2 hours. After mixing and discharging, take out 400g and add 2g of long-chain polydimethylsiloxane mixture with an average molecular weight of 500,000 containing 50% 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, Mix well on an open mill. The resulting mixture was extruded using a screw extruder into a sheet 0.6 mm thick, 30 mm wide, (die channel length 5 cm) 40 cm long....

Embodiment 2

[0050] 700g of long-chain polydimethylsiloxane with an average molecular weight of 500,000, 100g of terminal vinyl dimethylsiloxane with an average molecular weight of 5000, 200g of polydimethylsiloxane with an average molecular weight of 500, respectively Add it into a 2L kneader, knead and stir at room temperature for 5 minutes, then add 1000g flake boron nitride powder with an average particle size of 40μm, 500g spherical aluminum nitride powder with an average particle size of 3μm, and 300g average particle size Boron nitride powder with a diameter of 2μm, 200g of BET method has a specific surface area of ​​200m 2 / g of fumed silica, mixed at room temperature for 2 hours. After mixing and discharging, take out 400g and add 2g of long-chain polydimethylsiloxane mixture with an average molecular weight of 500,000 containing 50% 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, Mix evenly on an open mill, and then extrude into a sheet with a thickness of 0.6 mm, a width of 30 mm, ...

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Abstract

The invention discloses an anisotropic insulating and heat-conducting composition and a preparation method thereof. The anisotropic insulating and heat-conducting composition is prepared from the following raw materials in parts by mass: 50-95 parts of vinyl-containing high-molecular-weight polysiloxane, 5-50 parts of vinyl-containing low-molecular-weight polysiloxane, 5-50 parts of non-reactive low-molecular-weight polysiloxane, 100-400 parts of sheet-like heat-conducting filler, 50-400 parts of insulating and heat-conducting filler, 5-20 parts of nano-reinforcing filler, 1-10 parts of a heatresistant additive, and 0.05-15 parts of a curing agent. The anisotropic insulating and heat-conducting composition is used for heat dissipation of electronic components such as high-power chips, theheat conductivity coefficient is improved by orienting the sheet-like heat-conducting filler, the nano-reinforcing filler is added to improve the physical properties of condensate, the heat conductivity coefficient of the heat-conducting composition is greater than 9 W / (m.K), the tensile strength is greater than 0.2 MPa, and the elongation at break is greater than 80%; and the anisotropic insulating and heat-conducting composition is prepared by an extrusion lamination process, operation is simple, and large-scale continuous production is facilitated.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials for components, in particular to an anisotropic insulating and heat-conducting composition and a preparation method thereof. Background technique [0002] With the continuous development of electronic technology, the size of components is getting smaller and smaller, and the integration level is also increasing. They will generate a lot of heat during operation, and the accumulation of these heat will have a negative impact on the service life and reliability of components. Fatal impact. In order to quickly dissipate the heat generated during the operation of components, it is necessary to require a thermally conductive material with a higher thermal conductivity to conduct the heat. At the same time, in many applications, there are strict requirements on the insulation performance of thermally conductive materials, so the addition of conductive powder is strictly restricted by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08K7/00C08K3/38C08K7/18C08K3/22C08K3/36C08K5/14C08K13/04C09K5/14
CPCC08K2003/2227C08K2003/385C08K2201/003C08K2201/011C08K2201/014C08L83/04C08L2203/20C08L2205/025C08L2205/03C09K5/14C08K7/00C08K3/38C08K7/18C08K3/22C08K3/36C08K5/14C08K13/04
Inventor 奚家国陶志伟
Owner SHENZHEN FRD SCI & TECH
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