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A method for reducing the thermal resistance of liquid metal heat conducting sheet

A technology of liquid metal and liquid metal alloy, which is applied in the direction of heat exchange materials, chemical instruments and methods, semiconductor devices, etc., can solve the problems of different effects of heat conduction sheets, affecting the application effect, uneven pressure, etc.

Active Publication Date: 2021-01-08
广东光钛领先新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One disadvantage is that although it can fill the interface gap after melting, due to the uneven pressure of the thermal interface after assembly, some places have better coverage / wetting, while some places are poorer. This is on a larger heat dissipation surface. particularly prominent
As a result, different heat conduction sheets will have different effects, fluctuating from high to low, which will seriously affect its application effect

Method used

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  • A method for reducing the thermal resistance of liquid metal heat conducting sheet

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preparation example Construction

[0045] The preparation method of the liquid metal alloy includes the following steps: weighing the raw material of the liquid metal alloy according to the composition formula, mixing it uniformly and adding it into the crucible; raising the temperature to 250-300°C, keeping it warm for 2-8 hours, and then cooling to At room temperature, the obtained liquid metal alloy is placed in a container protected by an inert atmosphere for later use.

[0046] As a preferred embodiment, the pretreatment process of the liquid metal alloy is: stirring the liquid metal alloy at room temperature for a certain period of time.

[0047] As a preferred embodiment, the stirring speed is 10-100 rpm, and the stirring time is 0.5-2 hours.

[0048] The stirring time can be, for example, 0.5 hour, 0.6 hour, 0.7 hour, 0.8 hour, 0.9 hour, 1 hour, 1.2 hour, 1.3 hour, 1.4 hour, 1.5 hour, 1.6 hour, 1.7 hour, 1.8 hour, 1.9 hour, 2 hours.

[0049] As a preferred embodiment, the stirring speed is 10-100 rpm,...

Embodiment approach

[0055] In a preferred embodiment, the grammage of the glass fiber mesh cloth is 110-200 g / square meter.

[0056] As a preferred embodiment, the method for reducing the thermal resistance of the liquid metal alloy heat conducting sheet includes the following steps:

[0057] (1) Stir the liquid metal alloy at room temperature for 0.5 to 2 hours at a stirring speed of 10-100rpm.;

[0058] (2) Clean the glass fiber mesh cloth with acetone and ethanol successively at the same time;

[0059] (3) Smear the liquid metal alloy pretreated in step (1) on the glass fiber mesh cloth cleaned in step (2).

[0060] Wherein, when applying in step (3), use a cotton swab to wipe the surface of the glass fiber mesh cloth several times, so that the liquid metal alloy is fully in contact with the mesh cloth.

[0061]The applicant unexpectedly found that by applying the liquid metal alloy on the glass fiber mesh cloth with a grammage of 110-200g / square meter and a thickness of 0.01-0.2 mm after pr...

Embodiment 1

[0066] A method for reducing the thermal resistance of a liquid metal heat conducting sheet, comprising the following steps:

[0067] (1) Stir the liquid metal alloy at room temperature for 1 hour, and the stirring speed is 80rpm.;

[0068] (2) Clean the glass fiber mesh cloth with acetone and ethanol successively at the same time;

[0069] (3) Smear the liquid metal alloy pretreated in step (1) on the glass fiber mesh cloth cleaned in step (2).

[0070] The liquid metal alloy is composed of gallium, indium and tin.

[0071] The mass percentage of described gallium, indium, tin is:

[0072] Indium 21%;

[0073] Gallium 60%;

[0074] Tin remaining amount.

[0075] The preparation method of the liquid metal alloy includes the following steps: weighing the raw material of the liquid metal alloy according to the composition formula, mixing it uniformly and adding it into the crucible; raising the temperature to 280°C, keeping it warm for 5 hours, and then cooling to room temp...

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Abstract

The invention relates to the field of heat conduction materials, in particular to a method for reducing thermal resistance of a liquid metal heat-conducting fin. The invention discloses the method forreducing thermal resistance of a liquid metal heat-conducting fin. The method comprises the step of smearing a pretreated liquid metal alloy on glass fiber gridding cloth. According to the invention,through the improvement of the liquid metal alloy, the liquid metal alloy heat-conducting fin completely infiltrates and fills gaps of the heat-conducting surface, thereby achieving the effects of low heat resistance and high heat conductivity.

Description

technical field [0001] The invention relates to the field of heat-conducting materials, in particular to a method for reducing the thermal resistance of a liquid metal heat-conducting sheet. Background technique [0002] At present, the rapid development of microelectronics technology has greatly increased the total power density of electronic chips, and the heat flux has also increased. The quality of heat dissipation will seriously affect the system stability and hardware life. Chip technology has put forward an unprecedented urgent demand for high-performance heat dissipation methods, making ultra-high heat flux chip heat dissipation an extremely active research field in the world. [0003] The heat dissipation of the chip requires the use of a thermal interface material to contact the heat sink or heat dissipation surface. The function of this interface material is to fill the micro-gap between the two interfaces. The traditional thermal interface material is thermal g...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373C09K5/12
CPCC09K5/12H01L23/3733H01L23/3736
Inventor 童潇
Owner 广东光钛领先新材料有限公司