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Three-dimensional composite material, preparation method and application thereof, substrate and electronic device

A technology of composite materials and polymer materials, applied in the fields of substrates and electronic devices, three-dimensional composite materials and their preparation, can solve the problem that the thermal conductivity of composite materials cannot be effectively increased, the dielectric constant of composite materials can be increased, and the mechanical properties of materials can be deteriorated. problems, to achieve the effect of facilitating large-scale production, enhancing mutual contact, and requiring less production equipment

Active Publication Date: 2019-10-22
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the high interfacial thermal resistance between the polymer matrix and the thermally conductive filler, simple filling cannot effectively increase the thermal conductivity of the composite
In this case, the ideal thermal conductivity can only be obtained by continuously increasing the volume fraction of the filler, but an excessively high filler ratio will increase the dielectric constant of the composite material and deteriorate the mechanical properties of the material

Method used

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  • Three-dimensional composite material, preparation method and application thereof, substrate and electronic device
  • Three-dimensional composite material, preparation method and application thereof, substrate and electronic device
  • Three-dimensional composite material, preparation method and application thereof, substrate and electronic device

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Embodiment 1

[0037] figure 1 It is a structural schematic diagram of a three-dimensional composite material according to an embodiment of the present invention. Such as figure 1 As shown, the three-dimensional composite material includes a thermally conductive filler BN as a three-dimensional network framework 1 and a polymer 2 filled in the three-dimensional network framework 1. In this embodiment, the polymer 2 is epoxy resin.

[0038] The preparation method of the three-dimensional composite material is as follows:

[0039] 1) Mix BN powder with an average particle size of 3 μm and PVA with an average particle size of 160 μm at room temperature according to the required volume fraction;

[0040] 2) The uniformly mixed PVA and BN powders are pressed in a tablet press at 300MPa for 5 minutes to form a tablet;

[0041] 3) heat-treating the sheet material obtained in step 2) at 700°C for 10 hours to decompose the PVA to obtain a three-dimensional network skeleton of BN, which is self-sup...

Embodiment 2

[0044] A three-dimensional composite material, the thermal conductive filler is diamond, and the filled polymer is PDMS silicone rubber.

[0045] The preparation method of the three-dimensional composite material is as follows:

[0046] 1) The diamond powder with an average particle size of 3 μm and the camphor with an average particle size of 500 μm are uniformly mixed according to the required volume fraction at room temperature;

[0047] 2) The uniformly mixed camphor and diamond powder are pressed into a sheet under a pressure of 10MPa for 30min in a tablet press;

[0048] 3) heat-treating the sheet material obtained in step 2) at 200° C. for 12 hours to decompose the camphor to obtain a three-dimensional network skeleton of diamond;

[0049] 4) Put the three-dimensional network skeleton obtained in step 3) into a polytetrafluoroethylene mold and fill it with PDMS silicone rubber, and place it in a vacuum oven to remove air bubbles for 0.5 hours before curing. The curing ...

Embodiment 3

[0051] A three-dimensional composite material, the three-dimensional composite material such as figure 1 As shown, wherein the thermally conductive filler is AlN, and the filled polymer is epoxy resin.

[0052] The preparation method of the three-dimensional composite material is as follows:

[0053] 1) Mix AlN powder with an average particle size of 50 μm and PC with an average particle size of 500 μm at room temperature according to the required volume fraction;

[0054] 2) The uniformly mixed PC and AlN powders are pressed into tablets in a tablet press at 500MPa for 3 minutes;

[0055] 3) heat-treating the sheet material obtained in step 2) at 1000° C. for 7 hours to decompose PC to obtain a three-dimensional network skeleton of AlN;

[0056] 4) The three-dimensional network skeleton obtained in step 3) is placed in a polytetrafluoroethylene mold and filled with bisphenol A epoxy resin, methyl hexahydrophthalic anhydride is selected as a curing agent, and imidazole is us...

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Abstract

The invention discloses a three-dimensional composite material having a high thermal conductivity and a low dielectric constant, a preparation method and an application thereof, a substrate and an electronic device. The preparation method of the three-dimensional composite material comprises the following steps: mixing a thermally conductive filler with a pyrolysis material, and pressing the obtained mixture to obtain a pressed product; thermally treating the pressed product to remove the pyrolysis material to obtain a three-dimensional network skeleton; and filling the three-dimensional network skeleton material with a polymer material, and performing curing, wherein the particle size of the pyrolysis material is at least 8 times the particle size of the thermally conductive filler. The construction and the effective regulation of the three-dimensional network skeleton are realized by selecting the particle sizes of the thermally conductive filler and the pyrolysis material. Pressurization enhances the mutual contact between the fillers for the three-dimensional skeleton, and reduces the thermal resistance of the interface, and the three-dimensional composite material can rapidlyconduct heat in the three-dimensional skeleton heat conduction path formed by the thermally conductive filler to achieve the effect of greatly improving the thermal conductivity. The method has the advantages of simplicity in operation, low requirements for production devices, and facilitation of large-scale production.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a three-dimensional composite material and its preparation method, application, substrate and electronic device. Background technique [0002] With the development trend of light, thin, short, small, high-performance and low-cost electronic devices, the expansion of high-density integrated circuits to three-dimensional direction will cause a series of problems in thermal, electrical, mechanical and energy supply. In particular, the heat generated by electronic components has become a key factor affecting the performance and service life of electronic components. In 5G mobile communication technology, the integration level is further improved, and the component density is further increased. Especially in order to ensure a large amount of data exchange, MIMO technology is widely used. So many antennas will cause serious heating problems. Therefore, the developmen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/04C08L9/02C08K3/38C08K3/28C08K3/04C08K3/22
CPCC08K3/38C08K3/28C08K3/04C08K3/22C08K2003/2296C08K2003/282C08K2003/385C08K2201/003C08L63/00C08L83/04C08L9/02
Inventor 汪宏徐信未
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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