Method for gluing and drying copper-clad plate and device used by method

A technology for copper clad laminate and gluing, applied in the field of gluing drying method for copper clad laminate and the device used, can solve the problems of slow gluing speed and high defect rate, and achieve short lamination time, reduced rent, and flat surface. Effect

Active Publication Date: 2019-10-25
黄瑞有
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned deficiencies existing in the prior art, the present invention provides a glue drying method on a copper clad laminate and a device used therefor to solve the problems of high defect rate, Slow gluing speed and many other problems

Method used

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  • Method for gluing and drying copper-clad plate and device used by method
  • Method for gluing and drying copper-clad plate and device used by method
  • Method for gluing and drying copper-clad plate and device used by method

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Embodiment Construction

[0052] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0053] Such as Figure 1-Figure 9 As shown, the glue drying method for copper clad laminates of the present invention comprises the following steps:

[0054] Step 1, preparing glue;

[0055] Step two, glass fiber cloth glue:

[0056] Put the glue solution prepared in step 1 into the glue storage box 1061, and then pull the glass fiber cloth into it to realize gluing;

[0057] Step 3, surface drying treatment:

[0058] Transfer the semi-finished product after gluing in step 2 to the surface drying box 2060 for surface drying. The surface drying time is 5 seconds to 30 seconds. The temperature of the surface drying box 2060 is controlled between 80 ° C and 150 ° C to achieve surface drying ;

[0059] Step 4, cropping:

[0060] The semi-f...

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Abstract

The invention belongs to the technical field of copper-clad plate preparation, and particularly relates to a method for gluing and drying a copper-clad plate. The method comprises the steps of adhesive solution preparation, fiberglass cloth gluing, surface dry treatment, tailoring, and stacking and drying. The invention further relates to a device used by the method. The device comprises two traction supports and a drying box. The two traction supports face each other oppositely front and back, the traction supports are in reversed-U shapes, convex blocks are integrally formed at the right ends of the top surfaces of the traction supports, inclined support blocks low on the left and high on the right are integrally formed at the top ends of the right surfaces of the traction supports, gluing assemblies are mounted between the two front-back oppositely-faced convex blocks, gluing assemblies are also mounted between the two front-back oppositely-faced inclined support blocks, each gluingassembly comprises a gluing motor, a gluing rolling barrel, a fixing plate and a glue storing box, the fixing plates are fixedly mounted on power output shafts of the gluing motors, the glue storingboxes are mounted on the fixing plates, sleeve shafts are mounted at the rear end tips of the power output shafts of the gluing motors, the gluing rolling barrels sleeve the sleeve shafts and are fixed to the sleeve shafts, and first bearings are fixedly mounted at the two ends of each sleeve shaft.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate preparation, and in particular relates to a method for drying glue on a copper-clad laminate and a device used therefor. Background technique [0002] Copper clad laminate is an extremely important basic material for printed circuit boards. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and copper-plated on copper clad laminates. Different printed circuits (single-sided, double-sided, multilayer). As the substrate material in the manufacture of printed circuit boards, copper clad laminates mainly play the role of interconnection, insulation and support for printed circuit boards, and have a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality, processability, manufacturing level, manufacturing cost and long-term reliability and stability of p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B38/16H05K3/02D06N3/12D06N3/00D06H7/00B05C1/10B05C13/02B05C9/14B05D3/02
CPCB05C1/10B05C9/14B05C13/02B05D3/0254B32B37/1284B32B38/164B32B2309/02B32B2309/04B32B2457/08D06H7/00D06N3/0022D06N3/0077D06N3/0088D06N3/12H05K3/022
Inventor 黄瑞有
Owner 黄瑞有
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