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Method of electroless copper plating of surface of diamond particle with sensitized and activated metal plated layer

A technology of diamond particles and surface chemistry, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high cost of chemical copper plating and expensive metal palladium, and achieve low cost and simple process Effect

Active Publication Date: 2019-10-25
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the traditional diamond electroless plating of Cu must go through SnCl 2 Sensitization, PdCl 2 Activation pretreatment, otherwise plating cannot be done successfully
The expensive metal palladium makes the cost of electroless copper plating too high

Method used

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  • Method of electroless copper plating of surface of diamond particle with sensitized and activated metal plated layer
  • Method of electroless copper plating of surface of diamond particle with sensitized and activated metal plated layer

Examples

Experimental program
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Effect test

Embodiment 1

[0025] A method for electroless copper plating on the diamond particle surface of metal coating sensitization activation, its concrete steps are as follows:

[0026] (1) Put diamond particles and W powder with a mass ratio of 10:1 into the mortar, and add NaCl and BaCl with a mass ratio of 1:10 2 Mix salt, mix evenly (mixed powder of diamond particles and W powder with NaCl and BaCl 2 The mass ratio of mixed salt is 1:1), obtains mixed material; Mixed material is placed in heating furnace, under N 2 -H 2 Mixed gas (N 2 and H 2 The volume ratio is 85%:15%) and heated to 1100°C under protection, and kept for 30 minutes; after the product is cooled, it is cleaned and dried to obtain diamond particles coated with tungsten on the surface;

[0027] (2) take by weighing 9.8g of copper sulfate (CuSO 4 ·5H 2 O) and 0.02g of 2,2-bipyridine (C 10 h 8 N 2 ), add 250mL deionized water to dissolve to obtain blue solution A; weigh 27g disodium edetate (C 10 h 14 N 2 Na 2 o 8 2H...

Embodiment 2

[0032] A method for electroless copper plating on the diamond particle surface of metal coating sensitization activation, its concrete steps are as follows:

[0033] (1) Put diamond particles and W powder with a mass ratio of 10:1 into the mortar, and add NaCl and BaCl with a mass ratio of 1:10 2 Mix salt, mix evenly (mixed powder of diamond particles and W powder with NaCl and BaCl 2 The mass ratio of mixed salt is 1:1), obtains mixed material; Said mixed material is placed in heating furnace, under N 2-H 2 Mixed gas (N 2 and H 2 The volume ratio is 85%:15%) and heated to 1100°C under protection, and kept for 30 minutes; after the product is cooled, it is cleaned and dried to obtain diamond particles coated with tungsten on the surface;

[0034] (2) take by weighing 9.8g of copper sulfate (CuSO 4 ·5H 2 O) and 0.02g of 2,2-bipyridine (C 10 h 8 N 2 ), add 250mL deionized water to dissolve to obtain blue solution A; weigh 27g disodium edetate (C 10 h 14 N 2 Na 2 o ...

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Abstract

The invention discloses a method of electroless copper plating of the surface of a diamond particle with a sensitized and activated metal plated layer. The method comprises the steps that a tungsten plated layer covers the surface of a diamond particle through a salt bath tungsten plating method, so that a diamond particle with the tungsten plated surface is obtained; then the diamond particle isadded to electroless copper plating liquid, and electroless copper plating is conducted on the surface of the tungsten plated layer; and after cleaning and drying are accomplished, the diamond particle with the copper plated surface is obtained. By the adoption of the method, the process that precious metal sensitization and activation are required in the conventional electroless copper plating technology is omitted, the obtained copper plated layer is uniform and compact, and the performance of the combination between the copper plated layer and the diamond particle is high.

Description

technical field [0001] The invention relates to a method for electroless copper plating on the surface of diamond particles sensitized and activated by metal plating, and belongs to the field of metal matrix composite material preparation. Background technique [0002] Diamond is not only the hardest element in nature, but also has excellent thermal conductivity (2200W m -1 ·K -1 ), low thermal expansion coefficient (0.86×10 -6 / ℃) and low density (3.52g·cm -3 ), so it has many important industrial uses, such as fine grinding materials, electronic packaging materials, various drill , Drawing die , It is also used as a part of many precision instruments. However, diamond tool materials are mostly produced by powder metallurgy, and the sintering temperature is relatively high. When the diamond is heated to about 700°C in the air, it will begin to oxidize and lose weight, and the compression resistance will decrease. When the diamond is above 1000°C, it will be partially ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/38C23C18/18
CPCC23C18/1879C23C18/38
Inventor 程继贵卫陈龙魏邦争陈鹏起徐仙
Owner HEFEI UNIV OF TECH