Gas-barrier aluminum vapor deposition film and laminated film using same

Abstract

The purpose of the present invention is to provide a gas-barrier aluminum vapor deposition film characterized by: being produced by forming a vapor deposition layer on at least one surface of a base material film surface, the composition of the vapor deposition layer continually changing from an aluminum metal layer having a film thickness of 25 nm or more to an aluminum oxide layer having a filmthickness of 5 nm or more, and further laminating thereon a gas-barrier resin layer having a film thickness of 0.1 to 4 Mum; and the gas barrier resin layer being formed of a gas-barrier composition obtained by polycondensation of a vinyl alcohol-based resin and an organic silicon compound having an alkoxy group. Provided are: a gas-barrier aluminum vapor deposition film that has excellent oxygenand water vapor barrier properties, laminate strength, flex resistance, and tensile resistance; and a laminated film using the same.

Description

technical field [0001] The present invention relates to a gas-barrier aluminum vapor-deposited film having excellent oxygen and water vapor barrier properties, lamination strength, bending resistance, and stretch resistance. Background technique [0002] Packaging materials using aluminum foil not only have design properties based on metallic luster, but also have light-shielding properties and excellent gas barrier properties. Outer packaging materials for vacuum insulation materials such as thermal insulation materials for thermal insulation materials and residential insulation panels. However, packaging materials using aluminum foil have problems in that the handling of the aluminum foil is difficult because pinholes are likely to occur, and the load on the incinerator due to the residue after incineration is large. [0003] In order to solve the above-mentioned problems of aluminum foil, an aluminum vapor-deposited film obtained by a physical vapor deposition method suc...

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Problems solved by technology

However, the packaging material using aluminum foil has the following problems: it is difficult to handle the aluminum foil because it is prone to pinholes, and the load on the incinerator due to the residue after incineration is large.

[0006] On the other hand, the thermal conductivity of aluminum is about 200W / m·K, which is higher than the thermal conductivity of polyethylene terephthalate (about 0.14W / m·K), which is a typical raw material for packaging materials, and the thermal conductivity of air. rate (approximately 0.02W / m·K), therefore, the heat insulation material obtained by laminating aluminum foil has the following problems: a thermal bridge in which heat moves along the aluminum foil portion occurs, and the heat insulation performance of the vacuum heat insulation material is greatly reduced

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