Conductive resin composition and production method for shielded package using same

A technology of conductive resin and composition, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., and can solve the problem of reduced shielding effect of packages, changes in chromaticity of shielding layers, and rise in the resistance value of resin compositions, etc. Eliminate problems, achieve excellent tightness, inhibit discoloration, and achieve the effects of efficient manufacturing

Inactive Publication Date: 2019-10-25
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned electronic components for wireless communication have the following problems: Not only are they prone to generate noise, but they are also highly sensitive to noise, and they are prone to failure when exposed to external noise
[0005] But the problem is that if the traditional shielded package enters the solder reflow process, the chromaticity of the shielding layer will change, and it is difficult to obtain a better appearance.
However, the problem is that if the amount of copper powder or silver-coated copper powder compounded in the resin composition is reduced, the resistance value of the resin composition will increase, so the shielding effect of the package will decrease.

Method used

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  • Conductive resin composition and production method for shielded package using same
  • Conductive resin composition and production method for shielded package using same
  • Conductive resin composition and production method for shielded package using same

Examples

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Embodiment

[0090] Hereinafter, although the content of this invention is demonstrated in detail based on an Example, this invention is not limited to the following content. In addition, "part" or "%" appearing below means a mass basis unless otherwise indicated.

[0091] [Example, Comparative Example]

[0092] The curing agent, conductivity The filler (d) and the solvent were compounded and mixed at the ratios described in Table 1 to obtain a conductive resin composition. A detailed description of each component used is as follows.

[0093] Compound (a1): DESIGNER MOLECURES Inc. Manufactured, trade name "BMI-689", weight average molecular weight = about 689

[0094] Compound (a2): DESIGNER MOLECURES Inc. manufactured by the United States, trade name "BMI-3000", weight average molecular weight = about 3000.

[0095] Compound (b1): Liquid glycidylamine-based epoxy resin, manufactured by ADEKA Co., Ltd., trade name "EP-3905S"

[0096] Compound (b2): Liquid glycidyl ether epoxy resin,...

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Abstract

Provided are: a conductive resin composition which has good shielding properties, good adhesion to a package, and which can, by spray coating, form a shield layer that is less likely to discolor evenunder severe heating conditions; and a production method for a shielded package using the conductive resin composition. The conductive resin composition contains at least (A) a compound which is represented by general formula (I), has a molecular weight of 500-2000, and has two or more maleimide groups in one molecule, (B) a thermosetting compound, (C) a compound having an imidazole group, and (D)a conductive filler.

Description

technical field [0001] The present invention relates to a conductive resin composition and a method for producing a shield package using the conductive resin composition. Background technique [0002] In recent years, electronic devices for wireless communication, which are used to transmit large volumes of data, have been installed in electronic devices such as mobile phones and tablet terminals. The aforementioned electronic components for wireless communication have the following problems: not only are they likely to generate noise, but they are also highly sensitive to noise, and are likely to cause malfunctions when exposed to external noise. [0003] On the other hand, in order to make electronic equipment smaller, lighter, and more functional, it is necessary to increase the mounting density of electronic components. However, the problem is that increasing the mounting density will not only increase the number of electronic components that become noise sources, but a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/08C08K5/34C08K5/3445C08L33/10C08L101/12H01L23/00H01L23/28
CPCC08K3/08C08K5/34C08K5/3445C08L33/10C08L35/00C08L63/00C08L101/12H01L23/00H01L23/28C08G59/4042C08L33/06C08G59/5073C08G59/58
Inventor 梅田裕明松田和大中园元
Owner TATSUTA ELECTRICWIRE & CABLE
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