Electron beam curing compound adhesive, flexible package compound film and preparation method thereof

An electron beam curing, flexible packaging film technology, applied in the field of curing glue, can solve the problems of low efficiency, limited use time of mixed glue, etc., and achieve the effect of strong penetration, excellent coating performance and wetting performance, and high energy.

Active Publication Date: 2019-10-29
中山市康和化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the process point of view, it takes more than 24 hours for the mixed glue to really work, and the efficiency is low.
Moreover, there is a limit on the use time of the mixed glue. In addition, the solvent-free two-component glue ne

Method used

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  • Electron beam curing compound adhesive, flexible package compound film and preparation method thereof
  • Electron beam curing compound adhesive, flexible package compound film and preparation method thereof
  • Electron beam curing compound adhesive, flexible package compound film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] The electron beam curing composite glue provided in this embodiment is made of the following raw materials with the following mass ratios:

[0058]

[0059] in:

[0060] The bifunctional aliphatic urethane acrylate is purchased from Taiwan Changxing Chemical Eternal, the model is DR-U301, and the weight average molecular weight is 15,000-20,000.

[0061] The 2-functionality polyester acrylate is a modified 2-functionality polyester acrylate resin, which is purchased from Foshan Dechuang United Polymer Material Co., Ltd., and the model is UV938A.

[0062] The organic-inorganic hybrid material 604X35 was purchased from Taiwan Changxing Chemical.

[0063] Silane coupling agent SN-7535 was purchased from Shanghai Shenzhu Chemical Industry.

[0064] The flexible packaging composite film prepared by the above-mentioned electron beam curing composite glue can be used.

[0065] The preparation method of the flexible packaging composite film comprises the following steps: ...

Embodiment 2

[0073] Different from Example 1, the first flexible packaging film is polyethylene terephthalate film (PET) in the step (2), and the second flexible packaging film is polyethylene film (PE), and what makes is PET / PE.

Embodiment 3

[0075] The difference from Example 1 is that in step (2), the first flexible packaging film is a biaxially oriented polyamide film (NY), and the second flexible packaging film is a polyethylene film (PE), which is NY / PE.

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PUM

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Abstract

The invention discloses an electron beam curing compound adhesive. The electron beam curing compound adhesive is prepared from the raw materials in parts by mass: 30-50 parts of two-degree-of-functionality aliphatic polyurethane acrylate, 10-30 parts of two-degree-of-functionality polyester acrylate, 10-15 parts of acryloylmorpholine, 10-20 parts of N,N-dimethylacrylamide, 10-15 parts of an organic and inorganic hybrid material and 0.5-2 parts of a silane coupling agent. According to the electron beam curing compound adhesive, an electron beam is adopted for curing, curing is fast, curing canbe achieved instantaneously (curing can be achieved for 0.01 second or even 0.005 second), and before the electron beam is not adopted for curing, the compound adhesive can be used repeatedly. The invention further discloses a flexible package compound film prepared from the electron beam curing compound adhesive and a preparation method of the flexible package compound film.

Description

technical field [0001] The invention belongs to the technical field of curing glue, and in particular relates to an electron beam curing composite glue, a flexible packaging composite film and a preparation method thereof. Background technique [0002] At present, the social flexible packaging film is compounded with environmentally friendly solvent-free compound glue. The main components are: NCO component and OH component. :85), the gluing compound roller system is heated up to 40-50 ℃, and the roller is coated with glue and compounded. Step 2 The composite product can be cut and processed after natural aging at room temperature ≥ 30°C for 48 hours; if bag making or packaging processing is required, it should be cured at 35-45°C and relative humidity 60%-70% for 24- 48 hours. [0003] It can be seen that ordinary solvent-free two-component glue is mixed at a temperature of 40-50°C to react with NCO and OH. From the process point of view, it takes more than 24 hours for ...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J167/06B32B27/08B32B27/32B32B27/36B32B27/34B32B7/12B32B33/00
CPCB32B7/12B32B27/08B32B27/32B32B27/34B32B27/36B32B33/00B32B2250/24C09J175/14C08L67/06
Inventor 陈志国区锦泉侯高明林秋云
Owner 中山市康和化工有限公司
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