Conductive silver adhesive, and preparation method and application thereof

A technology of conductive silver glue and silver nanosheets, which is applied in the field of conductive glue, can solve the problem that the conductive silver glue cannot be stretched, and achieve the effects of simple formula and production process, fast curing speed and adjustable viscosity

Active Publication Date: 2019-11-08
零感科技(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a conductive s

Method used

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  • Conductive silver adhesive, and preparation method and application thereof
  • Conductive silver adhesive, and preparation method and application thereof
  • Conductive silver adhesive, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1 Based on the total weight of silver nanosheets and low modulus polymer, silver nanosheets account for 70wt%

[0031] Silver nanosheets with a diameter of about 2 μm and a thickness of 5 to 10 nm were selected as conductive fillers, thermoplastic polyurethane elastomer TPU was used as the elastomeric polymer (Germany BASF 35A polyurethane), and dimethylformamide DMF was used as the organic solvent , TPU and DMF are first mixed in a weight ratio of 1:4, and then silver nanosheets and TPU are mixed in a weight ratio of 7:3. After fully stirring, a flexible sensor and wire for connecting PMDS elastomers can be obtained. Conductive silver paste. The SEM of the conductive silver glue after curing see figure 1 . Put the conductive silver paste between the wire and the flexible sensor electrode, volatilize the DMF at room temperature, and it will be completely volatilized within half an hour. The wire and the electrode are firmly connected, and the contact resist...

Embodiment 2

[0034] Embodiment 2 Based on the total weight of silver nanosheets and low modulus polymers, silver nanosheets account for 80wt%

[0035] Silver nanosheets with a diameter of about 2 μm and a thickness of 5 to 10 nm were selected as conductive fillers, thermoplastic polyurethane elastomer TPU was used as the elastomeric polymer (German BASF 35A polyurethane), dimethylformamide DMF was used as the organic solvent, and TPU Mix it with DMF at a weight ratio of 1:1.5, and then mix silver nanosheets and TPU at a weight ratio of 8:2. After fully stirring, it is used to 3D print patterned electrodes on flexible substrates. The conductive silver paste formulated with a high molecular polymer carrier with a weight ratio of TPU to DMF of 1:1.5 has increased viscosity, which can not only be smoothly extruded from the 3D printing nozzle, but also will not flow on the printed substrate, ensuring the pattern completeness and accuracy. At the same time, due to the reduced specific gravity o...

Embodiment 3

[0036] Embodiment 3 Based on the total weight of silver nanosheets and low modulus polymer, silver nanosheets account for 90wt%

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Abstract

The invention provides a conductive silver adhesive, and a preparation method and application thereof. The conductive silver adhesive comprises a silver nanosheet and a low-modulus high-molecular polymer carrier, wherein the low-modulus high-molecular polymer carrier comprises a low-modulus high-molecular polymer and an organic solvent, and the elastic modulus of the low-modulus high-molecular polymer is smaller than 100 MPa; the organic solvent accounts for 60-80% of the total weight of the high-molecular polymer carrier; and in terms of the gross weight of the silver nanosheet and the low-modulus high-molecular polymer, the silver nanosheet accounts for 70-90%, and the low-modulus high-molecular polymer accounts for 10-30%. According to the invention, the low-modulus high-molecular polymer is used as a binder for the conductive silver adhesive, and is adapted to the modulus of a flexible circuit, and polymers with different moduli can satisfy demands of flexible circuits with different moduli; and under the condition of large strain, the two-dimensional silver nanosheet in the conductive silver adhesive can still maintain a good conductive path, so the conductive silver adhesivehas high tensile properties and electrical conductivity.

Description

technical field [0001] The invention relates to the field of conductive glue, in particular to a conductive silver glue and its preparation method and application. Background technique [0002] In recent years, more and more attention has been paid to flexible, stretchable, and bendable electronic devices, such as curved displays and touch screens, radio frequency identification tags, wearable sensors, implantable medical devices, wristbands, watches, and even mobile phones. Flexibility and bendability are the future development trend of electronic equipment. The traditional method of constructing conductive paths is mainly realized by lead tin soldering or conductive silver glue of epoxy resin system with large modulus. However, lead-tin soldering has serious pollution and high soldering temperature, so it is not suitable for use on flexible substrates. The conductive silver paste of the epoxy resin system is also not suitable for flexible electronic components due to its...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J175/04H01B1/22
CPCC08K2003/0806C08K2201/011C09J9/02C09J175/04H01B1/22C08K7/00C08K3/08
Inventor 李中勇
Owner 零感科技(深圳)有限公司
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