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Encapsulating adhesive, preparation method therefor, encapsulating body and preparation method therefor

A technology of encapsulating glue and encapsulating body, which is applied in the direction of adhesives, semiconductor devices, electrical components, etc., can solve the problems of difficult storage of quantum dots, slow photocuring rate, and failure of quantum dots, so that the dispensing process is easier to achieve and the curing time is short , fast curing effect

Active Publication Date: 2019-11-12
TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged for application to prolong their service life.
[0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue, and the initiator in the colloid will generate active free radicals through high temperature, thereby initiating polymerization reaction, but for quantum dots, high temperature is easy Quenching the quantum dots and making them invalid; the other is to encapsulate the quantum dots with light-cured encapsulation glue, and polymerize the colloid through light-curing. This method effectively avoids the quenching of quantum dots, but the existing optical The cured encapsulant has high energy requirements, and it needs to absorb a large amount of energy to cure the colloid, so the light curing rate is slow

Method used

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  • Encapsulating adhesive, preparation method therefor, encapsulating body and preparation method therefor
  • Encapsulating adhesive, preparation method therefor, encapsulating body and preparation method therefor
  • Encapsulating adhesive, preparation method therefor, encapsulating body and preparation method therefor

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preparation example Construction

[0071] According to another aspect of the present invention, there is provided a method for preparing the above encapsulation glue, comprising: uniformly mixing various raw materials to obtain the encapsulation glue.

[0072] The method has simple process and low preparation cost, and the obtained encapsulation glue can be cured by ultraviolet light without high temperature curing, and has the advantages of high curing efficiency, fast curing speed and good environmental protection.

[0073] According to another aspect of the present invention, a method for preparing a package is provided, comprising: uniformly mixing the above-mentioned encapsulant with the material to be packaged, then applying it to the surface of a substrate, and then curing it with ultraviolet light to obtain a package.

[0074] The preparation method of the package body adopts the package glue to package the material to be packaged, and uses ultraviolet light to cure, which has the advantages of fast curi...

Embodiment 1

[0096] An encapsulant, mainly prepared from the following raw materials in parts by mass: 40 parts of dipropylene glycol diacrylate, 30 parts of pentaerythritol triacrylate, 10 parts of NeoRad U-10-15T, 1 part of Omnirad 907 ultraviolet photoinitiator and benzene Ketone 1 part.

Embodiment 2

[0098] An encapsulant, mainly prepared from the following raw materials in parts by mass: 60 parts of dipropylene glycol diacrylate, 10 parts of pentaerythritol triacrylate, 50 parts of NeoRad U-10-15T, 15 parts of Omnirad 907 ultraviolet photoinitiator and benzene 8 servings of ketones.

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Abstract

The invention relates to the field of encapsulating materials and particularly provides an encapsulating adhesive, a preparation method therefor, an encapsulating body and a preparation method therefor. The encapsulating adhesive is mainly prepared from the following raw materials in parts by mass: 40-60 parts of difunctional acrylate, 10-30 parts of trifunctional acrylate, 10-50 parts of acrylateprepolymer, 1-15 parts of ultraviolet photoinitiator and 1-8 parts of photosensitizer. The encapsulating adhesive has the advantages of high curing efficiency, high curing speed, environment-friendliness, low cost and the like, has no need of high temperatures during curing and cannot quench quantum dots.

Description

technical field [0001] The invention relates to the field of packaging materials, in particular to a packaging glue and a preparation method thereof, a packaging body and a preparation method thereof. Background technique [0002] Quantum dots are semiconductor nanostructures that bind excitons in three spatial directions. By applying a certain electric field or light pressure to quantum dots, they will emit light of a specific frequency, and have high photochemical performance and long fluorescence lifetime. , therefore, quantum dots have good application prospects in the fields of lighting and display. However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of usually only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged before application to prolong their service life. [0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J167/06H01L33/56
CPCC09J4/00C09J167/06H01L33/56
Inventor 高欣李春峰李冬洪建明
Owner TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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