Encapsulating adhesive, preparation method therefor, encapsulating body and preparation method therefor

Abstract

The invention relates to the field of encapsulating materials and particularly provides an encapsulating adhesive, a preparation method therefor, an encapsulating body and a preparation method therefor. The encapsulating adhesive is mainly prepared from the following raw materials in parts by mass: 40-60 parts of difunctional acrylate, 10-30 parts of trifunctional acrylate, 10-50 parts of acrylateprepolymer, 1-15 parts of ultraviolet photoinitiator and 1-8 parts of photosensitizer. The encapsulating adhesive has the advantages of high curing efficiency, high curing speed, environment-friendliness, low cost and the like, has no need of high temperatures during curing and cannot quench quantum dots.

Description

technical field [0001] The invention relates to the field of packaging materials, in particular to a packaging glue and a preparation method thereof, a packaging body and a preparation method thereof. Background technique [0002] Quantum dots are semiconductor nanostructures that bind excitons in three spatial directions. By applying a certain electric field or light pressure to quantum dots, they will emit light of a specific frequency, and have high photochemical performance and long fluorescence lifetime. , therefore, quantum dots have good application prospects in the fields of lighting and display. However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of usually only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged before application to prolong their service life. [0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue,...

AI Technical Summary

Problems solved by technology

However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged for application to prolong their service life.

[0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue, and the initiator in the colloid will generate active free radicals through high temperature, thereby initiating polymerization reaction, but for quantum dots, high temperature is easy Quenching the quantum dots and making them invalid; the other is to encapsulate the quantum dots with light-cured encapsulation glue, and polymerize the colloid through light-curing. This method effectively avoids the quenching of quantum dots, but the existing optical The cured encapsulant has high energy requirements, and it needs to absorb a large amount of energy to cure the colloid, so the light curing rate is slow

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