Silicon carbide composite material and preparation method therefor
A composite material and silicon carbide technology, applied in the field of silicon carbide composite materials and their preparation, can solve problems such as limiting the scope of use, and achieve the effects of ensuring density, reducing costs, and reducing material costs
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Embodiment 1
[0030] The invention discloses a silicon carbide composite material, which comprises: 80% of silicon carbide powder, 15% of potassium acetylacetonate and 5% of polymethyl silicone resin in terms of mass fraction. The particle size of the silicon carbide powder was 100 μm.
[0031] The preparation method of the above-mentioned silicon carbide composite material comprises the following steps:
[0032] Step 1. Ultrasonic treatment is performed on 80% of silicon carbide powder, 15% of potassium acetylacetonate and 5% of polymethyl silicone resin. The frequency of ultrasonic treatment is 100KHz, and the ultrasonic time is 1h;
[0033] Step 2, put the homogeneously mixed raw materials into the cross-linking cracking furnace, under the protection of argon, raise the temperature of the cross-linking cracking furnace from 200°C to 1000°C at a heating rate of 1°C / min, and Insulate at 1000°C for 2 hours;
[0034] Step 3, ball milling the solid material obtained by cross-linking crackin...
Embodiment 2
[0038] The invention discloses a silicon carbide composite material, which comprises: 70% of silicon carbide powder, 20% of potassium isopropoxide and 10% of polyethyl silicone resin in terms of mass fraction. The particle size of the silicon carbide powder was 50 μm.
[0039] The preparation method of the above-mentioned silicon carbide composite material comprises the following steps:
[0040] Step 1. According to the mass fraction, 70% of silicon carbide powder, 20% of potassium isopropoxide and 10% of polyethyl silicone resin are subjected to ultrasonic treatment, the frequency of ultrasonic treatment is 100KHz, and the ultrasonic time is 1h;
[0041] Step 2, put the homogeneously mixed raw materials into the cross-linking cracking furnace, under the protection of argon, raise the temperature of the cross-linking cracking furnace from 200°C to 1000°C at a heating rate of 2°C / min, and Insulate at 1000°C for 3 hours;
[0042] Step 3, ball milling the solid matter obtained ...
Embodiment 3
[0046] The invention discloses a silicon carbide composite material, which comprises, by mass fraction: 60% of silicon carbide powder, 30% of potassium acetylacetonate, and 10% of 3-methacryloyloxypropyltris(trimethylsiloxy)silane. %. The particle diameter of the silicon carbide powder was 20 μm.
[0047] The preparation method of the above-mentioned silicon carbide composite material comprises the following steps:
[0048] Step 1, 60% of silicon carbide powder, 30% of potassium acetylacetonate and 10% of 3-methacryloyloxypropyl tris(trimethylsiloxy)silane are subjected to ultrasonic treatment, and the frequency of ultrasonic treatment is 100KHz , the ultrasonic time is 1h;
[0049] Step 2, put the homogeneously mixed raw materials into the cross-linking cracking furnace, under the protection of argon, raise the temperature of the cross-linking cracking furnace from 200°C to 1000°C at a heating rate of 1.5°C / min, and Keep warm at 1000℃ for 2.5h;
[0050] Step 3, ball milling...
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