Aluminum-scandium alloy sputtering target material and preparation method thereof

A technology of sputtering target material and alloy target, which is applied in sputtering coating, metal material coating process, ion implantation coating, etc., which can solve the problems of difficulty in smelting aluminum-scandium alloy, low density of alloy and long preparation period, etc. problems, to achieve the effect of industrial application, uniform alloy and good machinability

Pending Publication Date: 2019-12-03
何午琳
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an aluminum-scandium alloy sputtering target and its preparation method, which reasonably and effectively solves the problems of difficulty in smelting aluminum-scandium alloys in the prior art, low scandium content, complex processes, long preparation period, and alloy density. low problem

Method used

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Embodiment Construction

[0018] Through the following description of the embodiments, it will be more helpful for the public to understand the present invention, but the specific embodiments given by the applicant cannot and should not be regarded as limitations on the technical solutions of the present invention. Changes in the definition of technical features and / or formal but not substantive changes to the overall structure should be regarded as the scope of protection defined by the technical solution of the present invention.

[0019] Example:

[0020] An aluminum-scandium alloy sputtering target and a preparation method thereof, characterized in that: the content of scandium element in the aluminum-scandium alloy sputtering target is 5at%-50at%, the balance is aluminum, and the aluminum-scandium alloy The density of the sputtering target is 99.9%, and the thickness is 2-35mm;

[0021] The preparation method of the aluminum scandium alloy sputtering target comprises the following steps:

[0022...

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Abstract

The invention discloses an aluminum-scandium alloy sputtering target material and a preparation method thereof, and belongs to the technical field of high-performance aluminum-scandium alloy target materials. In the aluminum-scandium alloy target material, the content of scandium is 5 at%-50 at%, and the balance is aluminum. The preparation method comprises the following steps of 1, preparing materials; 2, smelting and casting ingots; 3, calcining or rolling; 4, sampling and detecting; 5, milling and cleaning; 6, carrying out vacuum packing. According to the present invention, the aluminum-scandium alloy target material is prepared through a vacuum induction levitation melting furnace and a rapid casting and rapid condensation technology, and the thickness of the prepared aluminum-scandiumalloy target material is 2-35 mm, the density is 99.9%, the scandium content is 5-50 at%, and the balance is the aluminum element. The preparation method is easy to operate, the alloy is uniform, theutilization rate of the expensive metal scandium is high, and the industrial application is facilitated. The characteristics of good component uniformity and good subsequent machinability satisfy therequirements of the semiconductors and the sputtering target materials in the special fields, and the defects in the prior art are overcome.

Description

technical field [0001] The invention relates to the technical field of high-performance aluminum-scandium alloy target materials, in particular to an aluminum-scandium alloy sputtering target material and a preparation method thereof. Background technique [0002] Adding a certain amount of scandium to aluminum can refine grains, increase recrystallization temperature, improve corrosion resistance, increase strength and plasticity, etc. Therefore, aluminum scandium alloys have high strength, corrosion resistance, high temperature resistance and weldability With good comprehensive performance, it has a wide range of applications in cutting-edge technology fields such as aerospace, nuclear energy engineering, semiconductors, transportation, and household appliances. With the rapid development of science and technology, as well as the emphasis of various countries on the research of key materials used in key fields, for aluminum scandium alloy targets, a simple and rapid method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C22C21/00C22C28/00
CPCC22C21/00C22C28/00C23C14/3407C23C14/3414
Inventor 何午琳
Owner 何午琳
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