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Femtosecond laser filament invisible cutting method and device

A femtosecond filament and invisible cutting technology, which is applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of uneven cutting surface and low cutting efficiency, achieve high energy density, improve cutting efficiency, and improve cutting efficiency. The effect of yield

Inactive Publication Date: 2019-12-06
CHONGQING INST OF EAST CHINA NORMAL UNIV +3
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Problems solved by technology

[0004] The purpose of the present invention is to provide a femtosecond optical filament implicit cutting method and device, which can effectively solve the problems of uneven cutting surface and low cutting efficiency caused by multiple focus scanning in existing laser implicit cutting

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  • Femtosecond laser filament invisible cutting method and device

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Embodiment Construction

[0016] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] see figure 1 , the femtosecond optical filament implicit cutting device shown includes a laser light source part 1, a beam control part 2, a workbench 3 and a control system 4. Described laser light source part 1 is used for providing the laser beam that produces light filament, and beam control part 2 is used for adjusting the transmission direction of laser beam and spot size, and workbench 3 is used for fixing material 33 to be cut, provides omnidirectional angle cutting, and The position of the focus point is monitored in real time to realize automatic correction, and the control system 4 is used to control the mutual communication and coordination of various components.

[0018] Described laser source part 1 comprises laser 11, first collimator 12 and second collimator 13, and described laser is used for producing femtosecond pulsed laser beam, can be so...

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Abstract

The invention aims to provide a femtosecond laser filament invisible cutting method. A laser device generates a femtosecond pulse laser beam, the laser beam is focused on the surface of a to-be-cut material by a focusing element, the peak power of the laser beam is larger than the power threshold of laser filaments formed in the to-be-cut material, the laser filament phenomenon is caused in the to-be-cut material, a dynamically balanced plasma channel is formed in the to-be-cut material under the self-focusing action and the defocusing effect formed by plasma generated by ionization of the to-be-cut material, and the plasma channel forms a modification layer to realize cutting of the to-be-cut material. The method can effectively solve the problems of uneven cutting surfaces and low cutting efficiency of existing laser invisible cutting due to repeated focus scanning. The invention also discloses a femtosecond laser filament invisible cutting device.

Description

technical field [0001] The invention relates to laser processing technology, in particular to a femtosecond optical filament implicit cutting method and device. Background technique [0002] Laser incision technology is a technology that constructs multiple focal points longitudinally in the hard material body, thereby forming multiple modified layers, and then realizing the physical division of materials. Compared with traditional cutting methods, hidden laser cutting technology gradually replaces traditional mechanical cutting with its fast processing speed, simple operation and precise processing. [0003] With the continuous development of science and technology, people have put forward more precise, faster and cross-scale cutting requirements for the accuracy of materials, environmental safety and work efficiency in the fields of electronic components, aviation and industrial processing. The existing laser hidden cutting technology has relatively large damage to the cu...

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Application Information

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IPC IPC(8): B23K26/38B23K26/70B23K26/046
CPCB23K26/046B23K26/38B23K26/70B23K26/702
Inventor 曾和平杜迎生袁帅徐晖聂源王勇王瑾
Owner CHONGQING INST OF EAST CHINA NORMAL UNIV
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