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Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method

A composition and electrolytic plating technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of insufficient coating film formation, reduce pre-treatment processes, reduce processes, and high plating precipitation sexual effect

Pending Publication Date: 2019-12-13
OKUNO CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the method described in Patent Document 1, there is room for research on the components of the molecular species of the activator, and there is still a problem that the formation of the coating film is insufficient.

Method used

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  • Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method
  • Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method
  • Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method

Examples

Experimental program
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Effect test

Embodiment

[0105] Examples and comparative examples are shown below to specifically describe the present invention. However, this invention is not limited to an Example.

[0106] (Production of electroless coating)

[0107] Prepare a flat plate (10cm×5cm×0.3cm, surface area about 1dm) of ABS resin (manufactured by UMG ABS Co., Ltd., trade name: UMG ABS3001M) 2 ) as the resin material of the object to be plated, and form an electroless plating film by the following method.

[0108] First, the resin material was immersed in an alkaline degreasing solution (produced by Okuno Pharmaceutical Co., Ltd., ACE CLEAN A-220 bath) at 40° C. for 5 minutes, and washed with water.

[0109] Next, additives were added in the combination shown in Tables 1 and 2 to water as a solvent to prepare pretreatment compositions of Examples and Comparative Examples. The water-washed resin material was immersed in the prepared pretreatment composition under the conditions of an immersion temperature of 68° C. and...

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Abstract

The present invention provides: a composition for pretreatment for electroless plating, which is capable of exhibiting high plating deposition performance without using harmful chromic acid and expensive palladium, while enabling reduction of the number of steps; a pretreatment method; and an electroless plating method. The present invention provides a composition for pretreatment for electrolessplating, which is characterized by containing 10 mg / L or more of manganese ions and 10 mg / L or more of monovalent silver ions.

Description

technical field [0001] The present invention relates to a pretreatment composition for electroless plating, a pretreatment method for electroless plating, and an electroless plating method. Background technique [0002] In recent years, for the purpose of reducing the weight of automobiles, resin molded articles have been used as automobile parts. For such purposes, for example, ABS resin, PC / ABS resin, PPE resin, polyamide resin, etc. are used as resin moldings, and plating of copper, nickel, etc. is performed in order to impart a sense of luxury and appearance. Furthermore, as a method of forming a conductive circuit by imparting conductivity to a resin substrate, a method of forming a plated film of copper or the like on a resin substrate is performed. [0003] As a general method of forming a plating film on resin materials such as resin substrates and resin moldings, after roughening the surface of the resin material by etching with chromic acid, neutralization and pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30C23C18/24
CPCC23C18/405C23C18/34C23C18/24C23C18/30C23C18/206C23C18/2066C23C18/40C23C18/2086C23C18/44C23C18/208
Inventor 永峰伸吾北晃治
Owner OKUNO CHEM IND CO LTD
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