A kind of oled structure and manufacturing method thereof

Abstract

The present invention relates to the technical field of OLEDs, in particular to an OLED structure comprising a base, on which a layer of anode is deposited, on which a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are sequentially deposited. The structure of the hole injection layer, the hole transport layer, the light-emitting layer, and the electron transport layer is distributed in a trapezoid, and the area of ​​each layer decreases gradually from bottom to top; an electron injection layer and a metal cathode are deposited on the electron transport layer, and the area of ​​the electron injection layer is larger than the hole injection layer, and the area of ​​the metal cathode is larger than that of the electron injection layer; finally, an aluminum oxide packaging layer and a silicon nitride packaging layer are sequentially deposited on the metal cathode. After adopting the above-mentioned structure and method, the present invention optimizes the film structure of the OLED device, reduces the step difference and slope of the organic film layer in the edge part of the light-emitting area, can significantly improve the uniformity of the metal cathode film layer in the edge part, and reduce the stress between the film layers , Improve product yield level.

Description

technical field [0001] The invention relates to the technical field of OLEDs, in particular to an OLED structure and a manufacturing method thereof. Background technique [0002] In the existing organic electroluminescent diode (OLED) preparation process, due to the large step difference and slope of the organic film layer at the edge of the light-emitting area (Edge), this makes the uniformity of the cathode (Cathode) film layer at the Edge part poor and there are A certain stress and a large step difference will also lead to poor packaging effect, which will eventually affect the current efficiency, or cause the device to short circuit or enter water / oxygen and be scrapped, affecting the yield level of the product. [0003] Chinese invention patent CN 107068905 A discloses an OLED packaging structure, including a substrate on which an OLED structure to be packaged is arranged; an inorganic cover layer is arranged on the substrate and the OLED structure so that the edge por...

AI Technical Summary

Problems solved by technology

[0002] In the existing organic electroluminescent diode (OLED) preparation process, due to the large step difference and slope of the organic film layer at the edge of the light-emitting area (Edge), this makes the uniformity of the cathode (Cathode) film layer at the Edge part poor and there are A certain stress and a large step difference will also lead to poor packaging effect, which will eventually affect the current efficiency, or cause the device to short circuit or enter into water / oxygen and be scrapped, affecting the yield level of the product

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