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Preparation method of water-resistant phenolic resin adhesive

A phenolic resin glue and water resistance technology, used in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of insufficient water resistance of phenolic resins, and improve water resistance and heat resistance Effect

Inactive Publication Date: 2019-12-20
HENAN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] For above-mentioned present situation, the present invention provides a kind of preparation method of water-resistant phenolic resin adhesive, to solve the problem of insufficient water resistance of phenolic resin

Method used

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  • Preparation method of water-resistant phenolic resin adhesive
  • Preparation method of water-resistant phenolic resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] 68.11g of methyltrimethoxysilane and 94.11g of phenol were mixed uniformly, 1.88g of methanesulfonic acid was added, the temperature was ramped up, and the reaction was carried out at 150 ° C to obtain an intermediate of alkylphenoxysilane; then cooled down, added 32.94g Xylene and 24.04 g of paraformaldehyde were reacted with an alkylphenoxysilane intermediate at 85° C. to the end point, distilled under reduced pressure, and dried under vacuum to obtain a water-resistant phenolic resin adhesive.

Embodiment 2

[0024] 41.27g of N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane and 94.11g of phenol were mixed uniformly, 1.41g of phosphoric acid was added, the temperature was gradually increased, and the reaction was carried out at 160 ° C to obtain alkane After cooling down, adding 23.53g of xylene and 26.13g of paraformaldehyde, reacted with the alkylphenoxysilane intermediate at 85 ° C to the end point, distilled under reduced pressure, and vacuum-dried to prepare Water-resistant phenolic resin adhesive.

Embodiment 3

[0026] 116.20 g of methyltrimethoxysilane and 228.29 g of bisphenol A were mixed uniformly, 3.44 g of p-toluenesulfonic acid was added, the temperature was gradually increased, and the reaction was carried out at 175 ° C to obtain an intermediate of alkylphenoxysilane; 68.49g of xylene and 70.61g of aqueous formaldehyde solution were added, reacted with the alkylphenoxysilane intermediate at 90° C. to the end point, distilled under reduced pressure, and dried under vacuum to obtain a water-resistant phenolic resin adhesive.

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Abstract

The invention discloses a preparation method of a water-resistant phenolic resin adhesive. The water-resistant phenolic resin adhesive is composed of xylene, a siloxane monomer, a phenolic compound, an acidic catalyst and an aldehyde compound. According to the preparation method of the water-resistant phenolic resin adhesive, a hydrophobic structure xylene ring and a Si-O bond with high bond energy (460 kJ / mol) are introduced into a phenolic resin structure, a hydrogen atom (H) in a phenolic hydroxyl group (-OH) can be replaced by a silicon atom (Si), so the water resistance and heat resistance of the modified phenolic resin are greatly improved.

Description

technical field [0001] The invention relates to the technical field of industrial production, in particular to a preparation method of a water-resistant phenolic resin adhesive. Background technique [0002] Phenolic resin, also known as bakelite, is a colorless or yellow-brown transparent solid. Due to its low production cost, mature preparation process and excellent comprehensive performance, it is widely and widely used in construction, machinery, electronics, aerospace, bonding and other fields. However, the heat resistance of traditional phenolic resins is affected due to the easy oxidation of phenolic hydroxyl groups and methylene groups in the molecular structure, which limits its application in some fields, especially in high temperature fields. [0003] In order to improve the thermal stability of phenolic resins, silicon atoms were introduced into the macromolecular structure of phenolic resins to partially block the phenolic hydroxyl groups, and at the same time, ...

Claims

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Application Information

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IPC IPC(8): C08G14/12C09J161/14
CPCC08G14/12C09J161/14
Inventor 袁天顺简亚溜邹文俊彭进刘鹏展赵硕
Owner HENAN UNIVERSITY OF TECHNOLOGY
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