Preparation Method of Micron-sized Particle Transmission Electron Microscopy Sample

Abstract

The invention discloses a method for preparing a micron-scale particle transmission electron microscope sample, which includes the following processes in a focused ion beam-scanning electron microscope dual-beam system: selecting sample particles of the order of micron size to be measured; applying an ion beam The deposition process deposits the first material on the outer surface of the sample particle to form a protective layer covering the sample particle; welding the sample particle covered with the protective layer to the sample carrier net; The sample particles covered with the protective layer are cut to form a test sample with a thickness on the order of nanometer size on the sample carrier. The method can simplify the sample preparation process of micron-sized particle transmission electron microscope samples, increase the speed of sample preparation, and increase the success rate of sample preparation.

Description

technical field [0001] The invention relates to the technical field of electron microscope testing, in particular to a method for preparing micron-sized particle transmission electron microscope samples. Background technique [0002] Focused ion beam (Focused Ion beam, FIB) technology is the most compatible technology with semiconductor technology, so in the semiconductor integrated circuit manufacturing industry, focused ion beam technology is widely used in micro-nano scale ion beam etching, ion beam deposition, Ion implantation and ion beam material modification and many other aspects. One of the important uses of focused ion beam technology is to prepare ultra-thin samples required for transmission electron microscope (Transmission Electron Microscope, TEM) observation. In the prior art, FIB technology and scanning electron microscope (Scanning Electron Microscope, SEM) have been combined Focused ion beam-scanning electron microscope dual-beam system integrated with tec...

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Problems solved by technology

However, epoxy resin requires a complex heating and curing process. In addition, the conductivity of epoxy resin is relatively poor, and if the elements in epoxy resin are close to the measured sample, there is no good contrast under TEM observation, which will give TEM sample preparation and observation bring many difficulties

In addition, the metal electroplating embedding method is also a commonly used powder sample TEM sample preparation method, but the metal electroplating embedding generally includes complicated processes such as configuring the electroplating solution, setting up the electroplating device, and electroplating. The temperature of the electroplating solution will have a great impact on the effect. And the sample is also vulnerable to damage during the electroplating process.

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