Method for preparing micron-sized particle transmission electron microscope sample

Abstract

The invention discloses a method for preparing a micron-sized particle transmission electron microscope sample, and method comprises the following processes performed in a focused ion beam-scanning electron microscope dual-beam system of selecting sample particles of a micron size order to be measured; applying an ion beam deposition process to deposit a first material on the outer surface of thesample particles to form a protective layer covering the sample particles; welding the sample particles coated with the protective layer to a sample carrier; and applying an ion beam cutting process to cut the sample particles coated with the protective layer to form a test sample with a thickness on the order of nanometers on the sample carrier. The method can simplify the sample preparation process of micron-sized particle transmission electron microscope samples, improve the speed of sample preparation, and improve the success rate of sample preparation.

Description

technical field [0001] The invention relates to the technical field of electron microscope testing, in particular to a method for preparing micron-sized particle transmission electron microscope samples. Background technique [0002] Focused ion beam (Focused Ion beam, FIB) technology is the most compatible technology with semiconductor technology, so in the semiconductor integrated circuit manufacturing industry, focused ion beam technology is widely used in micro-nano scale ion beam etching, ion beam deposition, Ion implantation and ion beam material modification and many other aspects. One of the important uses of focused ion beam technology is to prepare ultra-thin samples required for transmission electron microscope (Transmission Electron Microscope, TEM) observation. In the prior art, FIB technology and scanning electron microscope (Scanning Electron Microscope, SEM) have been combined Focused ion beam-scanning electron microscope dual-beam system integrated with tec...

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Problems solved by technology

However, epoxy resin requires a complex heating and curing process. In addition, the conductivity of epoxy resin is relatively poor, and if the elements in epoxy resin are close to the measured sample, there is no good contrast under TEM observation, which will give TEM sample preparation and observation bring many difficulties

In addition, the metal electroplating embedding method is also a commonly used powder sample TEM sample preparation method, but the metal electroplating embedding generally includes complicated processes such as configuring the electroplating solution, setting up the electroplating device, and electroplating. The temperature of the electroplating solution will have a great impact on the effect. And the sample is also vulnerable to damage during the electroplating process.

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