Aluminum nitride ceramic copper clad laminate and preparation method thereof
A technology for aluminum nitride ceramics and copper clad laminates, applied in the field of aluminum nitride ceramic copper clad laminates and their preparation, can solve the problems of difficult preparation process, high cost, poor adhesion between metal copper layers and ceramic substrates, etc. Low cost, easy to operate, beneficial to industrial production
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Embodiment 1
[0050] Soak an aluminum nitride ceramic substrate with a size of 100mm×100mm×0.5mm and a purity of 99.9% in acetone for 10 minutes to remove the oil on the surface, then rinse it with water, place it in deionized water for ultrasonic cleaning for 15 minutes, and use a hair dryer after taking it out Dry it, put it into an oven at a temperature of 130° C., and heat it for 15 minutes.
[0051] The TA13-10D magnetron sputtering coating system was used to prepare the metal titanium layer, wherein the target material was a titanium target with a purity of 99.99%, the sputtering pressure was 1.1Pa, the sputtering power was 120W, and the target distance was 60mm. Argon gas was used for protection during the injection process.
[0052] The TA13-10D magnetron sputtering coating system was used to prepare the metallic silver layer, wherein the target material was a silver target with a purity of 99.99%, the sputtering pressure was 1.0Pa, the sputtering power was 110W, and the target dist...
Embodiment 2
[0055] Soak an aluminum nitride ceramic substrate with a size of 100mm×100mm×0.5mm and a purity of 99.9% in acetone for 10 minutes to remove the oil on the surface, then rinse it with water, place it in deionized water for ultrasonic cleaning for 15 minutes, and use a hair dryer after taking it out Dry it, put it into an oven at a temperature of 130° C., and heat it for 15 minutes.
[0056] The TA13-10D magnetron sputtering coating system was used to prepare the metal titanium layer, wherein the target material was a titanium target with a purity of 99.99%, the sputtering pressure was 1.0Pa, the sputtering power was 130W, and the target distance was 60mm. Argon gas was used for protection during the injection process.
[0057] A TA13-10D magnetron sputtering coating system was used to prepare the metallic silver layer, wherein the target material was a silver target with a purity of 99.99%, the sputtering pressure was 0.8Pa, the sputtering power was 110W, and the target distan...
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Abstract
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