Semiconductor device and using method thereof

A semiconductor and equipment technology, applied in the field of semiconductor equipment, can solve the problems of inability to meet the needs of high-quality products, poor film quality, and low work efficiency

Pending Publication Date: 2020-01-03
SHENZHEN JING XIANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Commonly used magnetron sputtering equipment includes multiple chambers, and the chambers are interconnected, making the magnetron sputtering

Method used

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  • Semiconductor device and using method thereof
  • Semiconductor device and using method thereof
  • Semiconductor device and using method thereof

Examples

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Embodiment Construction

[0061] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0062] It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual impleme...

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Abstract

The invention provides a semiconductor device and a using method thereof. The semiconductor device comprises a transition cavity, at least one carrying table, a cooling plate, an air extraction port,and an exhaust port, wherein the transition cavity is arranged in front of a growth cavity; the at least one carrying table is arranged in the transition cavity, and allows at least one tray to be placed, the tray allows a substrate to be placed, and the at least one carrying table is allowed to rise and/or fall; the cooling plate is arranged in the transition cavity, and the cooling plate and theat least one carrying table are oppositely arranged; the air extraction port is arranged on one side of the transition cavity, and the transition cavity is vacuumized through the air extraction port;and the exhaust port is arranged on one side of the transition cavity, and the transition cavity is subjected to vacuum breaking treatment through the exhaust port. The semiconductor device is simplein structure and is capable of improving the uniformity of coatings. The invention further provides the using method of the semiconductor device.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a semiconductor device and a method for using the same. Background technique [0002] With the continuous advancement of integrated circuit production technology, the integration level of circuit chips has been greatly improved. At present, the number of transistors integrated in a chip has reached an astonishing tens of millions, and the signal integration of such a large number of active components requires more than ten layers of high-density metal interconnection layers for connection. Therefore, as an important process for preparing the above-mentioned metal interconnection layer, physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) technology has been widely used. [0003] In the microelectronics industry, magnetron sputtering technology is one of the important means of producing integrated circuits, liquid crystal displays, thin-film solar ce...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/56C23C14/50C23C14/54C23C14/06
CPCC23C14/35C23C14/566C23C14/50C23C14/505C23C14/542C23C14/541C23C14/0617C23C14/3407
Inventor 林信南游宗龙刘美华李方华児玉晃板垣克則
Owner SHENZHEN JING XIANG TECH CO LTD
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