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A method for interconnecting lead wires in metal shells

A metal shell and metal technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve reliability problems and other problems, and achieve the effects of high reliability, no external current damage, and high bonding strength

Active Publication Date: 2021-11-02
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the reliability problems existing in the traditional metal outer lead wire bonding interconnection process, thick copper wire lead welding interconnection process and thick lead spot welding interconnection process, and to provide a metal shell lead wire interconnection method

Method used

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  • A method for interconnecting lead wires in metal shells
  • A method for interconnecting lead wires in metal shells
  • A method for interconnecting lead wires in metal shells

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Embodiment Construction

[0019] The present invention provides a method for interconnecting lead wires in a metal shell, comprising:

[0020] a. If figure 1 As shown, through the spot welding process, the metal transition pad 3 is assembled on the end surface of the lead post 2 of the metal shell 1;

[0021] Micro-gap parallel spot welding or butt welding can be used for spot welding. The spot welding equipment is M3-20 DC spot welding device; the welding process can be decomposed into three steps. The gap parallel spot welding head is directly above the welding point; secondly, the micro-gap parallel spot welding head contacts and applies a certain pressure on the surface of the wire to be welded, and the spot welding equipment outputs a specific current to both the parallel positive electrode 4a and the parallel negative electrode 4b as required At the end, a strong current flows through the welding area, and the electric energy is converted into heat energy, which instantly forms a metal nugget at...

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Abstract

The invention discloses a lead wire interconnection method of a metal shell, comprising: a. assembling a metal transition solder piece on the end surface of a lead post of the metal shell through a spot welding process; b. connecting the metal transition solder plate with a circuit board through a wire bonding process Components are bonded and interconnected; when bonding in the present invention, the same metal Al-Al bonding process can be used, which has the obvious advantages of high bonding strength and high reliability; the spot welding process and bonding process adopted do not require flux and have a green , simplicity, and high temperature resistance; during spot welding, the current is only concentrated on the end face of the lead post that is insulated from the circuit, and will not cause electrical damage to the active components inside the circuit board, and has the advantage of no external current damage.

Description

technical field [0001] The invention relates to the technical field of thick-film hybrid integrated circuits, in particular to a method for interconnecting metal shell leads. Background technique [0002] The metal case lead interconnection process refers to the process of realizing the electrical interconnection between the metal case lead post and the circuit substrate. The metal case lead interconnection process is a basic assembly process for microelectronic products. In power hybrid integrated circuits, in order to carry large currents, it is generally necessary to use thick wires with a wire diameter of Φ200 μm or more in the interconnection process of metal casing leads. At present, the common methods for realizing high-power metal shell lead interconnection are wire bonding interconnection process, thick copper wire lead soldering interconnection process, and thick lead spot welding interconnection process. These metal shell lead wire interconnection processes all ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/85H01L2224/85009H01L2224/85801H01L2224/85897H01L2224/73265H01L2924/19107
Inventor 侯育增夏俊生杨宝平李寿胜魏刚剑
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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