Amplifier chip packaging structure and manufacturing method thereof

A chip packaging structure and amplifier technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as poor performance and excessive loss of millimeter-wave amplifiers, reduce parasitic inductance, and improve production efficiency , Increase the effect of cooling efficiency

Pending Publication Date: 2020-01-10
河北新华北集成电路有限公司
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Problems solved by technology

[0005] The purpose of the present invention is to provide an amplifier chip package structure and a method for making the package structure, so as to solve

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  • Amplifier chip packaging structure and manufacturing method thereof
  • Amplifier chip packaging structure and manufacturing method thereof
  • Amplifier chip packaging structure and manufacturing method thereof

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[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0031] Please refer to Figure 1 to Figure 5 Now, the amplifier chip packaging structure provided by the present invention and the method of manufacturing the packaging structure are described. The amplifier chip packaging structure includes a chip 100, a packaging substrate 200, and a cover 300; the upper surface of the chip 100 is provided with a number of metal pressure points 110, of which at least two metal pressure points 110 are chip RF ports 111; the packaging substrate 200 is provided with There are at least two dielectric layers 210 stacked from bottom t...

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Abstract

The invention, which relates to the technical field of chip packaging, provides an amplifier chip packaging structure and a manufacturing method thereof. The packaging structure comprises a chip, a packaging substrate and a sealing cover. The packaging substrate is provided with at least two dielectric layers; a groove is formed in the dielectric layer arranged at the top layer; a top metal layer,an intermediate metal layer and a bottom metal layer are arranged on the packaging substrate; and the sealing cover is arranged on the packaging substrate. According to the amplifier chip packaging structure provided by the invention, multi-layer wiring is realized and the chip is arranged in the groove, so that the connection length between the chip and the top metal layer of the packaging substrate is effectively reduced, the transmission capability between the chip and the top metal layer is enhanced, and the loss of radio frequency transmission is reduced. With the sealing cover with an inner cavity, one air layer with low dielectric loss is arranged above the chip, so that the dielectric loss caused by direct contact between the traditional packaging chip and the plastic packaging material is avoided and the performance loss of the millimeter wave band caused by the packaging structure is effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and more specifically relates to an amplifier chip packaging structure and a method for manufacturing the packaging structure. Background technique [0002] With the utilization and development of spectrum resources in radio frequency bands, the operating frequencies of various communication systems have been extended from lower frequency bands to millimeter wave frequency bands. The millimeter wave frequency band has the advantages of short wavelength, wide frequency bandwidth, and large information capacity. Millimeter wave communication technology is widely used in mobile communication, radar detection, electronic countermeasures, precision guidance and other fields. The millimeter-wave amplifier can amplify microwave signals in the millimeter-wave frequency band, and is a key component of the 5G communication receiving and transmitting system. Amplifier chips in the millimeter wave ba...

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Application Information

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IPC IPC(8): H01L23/13H01L23/498H01L23/31H01L21/50H01L21/56H01L21/60
CPCH01L21/50H01L21/56H01L23/13H01L23/315H01L23/49822H01L23/49838H01L24/85H01L2224/05554
Inventor 曲韩宾张晓朋吴兰高博邢浦旭崔培水谷江
Owner 河北新华北集成电路有限公司
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