Heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging and preparation method and application thereof

An intelligent power and semiconductor technology, applied in the application of semiconductor devices, thermometers, semiconductor/solid-state device components, etc., can solve problems such as the inability to meet the performance requirements of semiconductor packaging modules, and achieve high heat dissipation effect and good heat radiation effect.
CN110676237APending Publication Date: 2020-01-10TIANSHUI HUATIAN MICROELECTRONICS
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
TIANSHUI HUATIAN MICROELECTRONICS
Publication Date
2020-01-10

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Abstract

The invention relates to a heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging. The module integrates a control element (MCU), a driving element, a power switchelement and a temperature detection element, the packaging structure adopts industry minimum-level small surface mount package (SSOP), and the heat dissipation surface design is combined with clientpractical application, so that the best heat dissipation effect of the product is achieved. In the heat dissipation intelligent power semiconductor module, the effect of improving the detection sensitivity of the temperature detection element is achieved by designing the arrangement of the power elements; and meanwhile, by changing the structure of the heat dissipation surface, the heat dissipation effect of the product is greatly improved, the heat dissipation requirement of a higher-power product can be met, and the structure can also derive multiple types of packaging structure forms according to different power requirements of the power switch element of the product.
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Description

technical field

[0001] The invention relates to an intelligent power semiconductor module, in particular to a resin-encapsulated intelligent power semiconductor module with a high integrated circuit, in particular to the structure design, preparation method and application of a heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging. Background technique

[0002] In the motor rotation control devices used in products such as refrigerators, air conditioners, and washing machines called white goods, semiconductor devices that are equipped with control ICs and drive ICs for controlling and driving power switching elements are called IPM (Intelligent Power Modules). , Intelligent Power Module) (hereinafter referred to as IPM). Due to the structural shape and the complexity of the assembly process of the existing intelligent power module, it is difficult to transmit the heating temperature of the power switching element to the control element s...

Claims

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