Heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging and preparation method and application thereof

An intelligent power and semiconductor technology, applied in the application of semiconductor devices, thermometers, semiconductor/solid-state device components, etc., can solve problems such as the inability to meet the performance requirements of semiconductor packaging modules, and achieve high heat dissipation effect and good heat radiation effect.

Pending Publication Date: 2020-01-10
TIANSHUI HUATIAN MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to improve the sensitivity of micro-level packaging outline temperature detection and improve the heat dissipation effect of the product, thereby disclosing a new structure of heat dissipation intelligent power semiconductor module and its preparation method and application, especially for the existing micro-level packaging structure It has effective temperature measurement and heat dissipation effects, and solves the problem that the existing module structure cannot meet the performance requirements of increasingly smaller semiconductor packaging modules

Method used

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  • Heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging and preparation method and application thereof
  • Heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging and preparation method and application thereof
  • Heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging and preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0048] See attached Figure 1-3 ; A heat dissipation intelligent power semiconductor module based on a micro-level SSOP package, which consists of the following:

[0049] Lead frame 1, control element 2, drive element, power switch element, temperature detection element 3, plastic package 4, external lead wire 5, control element, drive element, power switch element, temperature detection element are all glued on the lead frame; drive The components include 3 integrated high and low voltage drive components 6; the power switch components are 3 high-voltage side power switch components 7 and 3 low-voltage side power switch components 8; the plastic package is a fully enclosed plastic package; the heat dissipation surface of the lead frame is located in the plastic package At the inner upper end, the length of the plastic package is not greater than 22 mm, the width is not greater than 11 mm, and the thickness is not greater than 2 mm (package size ≤ 22×11×2), lead frame, control...

Embodiment 2

[0051] See attached Figure 4-5 ; A heat dissipation intelligent power semiconductor module based on a micro-level SSOP package, which consists of the following:

[0052] Lead frame 1, control element 2, drive element, power switch element, temperature detection element 3, plastic package 4, external lead 5, the control element, drive element, power switch element, temperature detection element are all located on the lead frame; the drive element is 1 integrated low-voltage drive element 9, 1 integrated high-voltage drive element 10; power switch elements are 3 high-voltage side power switch elements 7, 3 low-voltage side power switch elements 8, high-voltage side power switch elements, low-voltage side power switch elements respectively Located on both sides of the lead frame, the temperature detection element is located on the side of the power switch element on the high-voltage side, and in the middle; the plastic package is a fully enclosed plastic package, and the package...

Embodiment 3

[0054] See attached Figure 6 ; A heat dissipation intelligent power semiconductor module based on a micro-level SSOP package, which consists of the following:

[0055]Lead frame 1, control element, drive element, power switch element, temperature detection element, plastic package 4, external leads, control element, drive element, power switch element, temperature detection element are all located on the lead frame, bonded to the convex structure The upper surface of the opening; the layout is the same as that of Embodiment 1; the driving element includes 3 integrated high and low voltage driving elements; the power switching element includes 3 high voltage side power switching elements and 3 low voltage side power switching elements; using 3 integrated high and low voltage When driving components (2 in 1), the high-voltage side and low-voltage side power components are arranged alternately, and the temperature detection component is located in the middle of the lead frame, c...

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Abstract

The invention relates to a heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging. The module integrates a control element (MCU), a driving element, a power switchelement and a temperature detection element, the packaging structure adopts industry minimum-level small surface mount package (SSOP), and the heat dissipation surface design is combined with clientpractical application, so that the best heat dissipation effect of the product is achieved. In the heat dissipation intelligent power semiconductor module, the effect of improving the detection sensitivity of the temperature detection element is achieved by designing the arrangement of the power elements; and meanwhile, by changing the structure of the heat dissipation surface, the heat dissipation effect of the product is greatly improved, the heat dissipation requirement of a higher-power product can be met, and the structure can also derive multiple types of packaging structure forms according to different power requirements of the power switch element of the product.

Description

technical field [0001] The invention relates to an intelligent power semiconductor module, in particular to a resin-encapsulated intelligent power semiconductor module with a high integrated circuit, in particular to the structure design, preparation method and application of a heat dissipation intelligent power semiconductor module based on micro-level SSOP packaging. Background technique [0002] In the motor rotation control devices used in products such as refrigerators, air conditioners, and washing machines called white goods, semiconductor devices that are equipped with control ICs and drive ICs for controlling and driving power switching elements are called IPM (Intelligent Power Modules). , Intelligent Power Module) (hereinafter referred to as IPM). Due to the structural shape and the complexity of the assembly process of the existing intelligent power module, it is difficult to transmit the heating temperature of the power switching element to the control element s...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/467H01L23/473G01K1/14G01K13/00
CPCH01L23/367H01L23/467H01L23/473G01K13/00G01K1/14H01L2924/181H01L2224/48137H01L2924/00012
Inventor 孙炎权崔卫兵蒋卫娟
Owner TIANSHUI HUATIAN MICROELECTRONICS
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