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A kind of low thermal conductivity phenolic foam material and preparation method thereof

A technology of phenolic foam material and low thermal conductivity, applied in the field of phenolic foam material, can solve problems such as increased thermal conductivity, high thermal conductivity, and impact on building insulation performance, and achieve the effect of high closed cell rate and low thermal conductivity

Active Publication Date: 2022-03-08
江阴市威腾铝箔合成材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the domestic phenolic foam board has the problem of high thermal conductivity, which is greater than 0.03W / mK; in addition, the closed pore structure in the phenolic foam makes it thermally insulating, but the pore structure ruptures as the foam is used for a long time , leading to an increase in the thermal conductivity, which manifests as problems such as rapid changes in thermal conductivity with time, which in turn affects the thermal insulation performance of the building

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0037] Preparation Technology of Starch Modified Phenolic Resin

[0038] The preparation process of starch-modified phenolic resin includes two steps: one is to liquefy starch, also known as hydrolyzed starch; the other is to add formaldehyde to the alkaline liquefaction system for addition and polycondensation reaction to generate modified phenolic resin.

[0039] Starch in the first step is preferably wheat starch, corn starch, potato starch, preferably corn starch.

[0040] Further, in the second step, formaldehyde is added dropwise twice, and after the dropwise addition, they are all kept warm and heated. The amount of formaldehyde added dropwise for the first time is 20-50% of the total formaldehyde. After the dropwise addition, the formaldehyde is kept at 80-95°C for 40- After 80 minutes, add the remaining formaldehyde dropwise for the second time, and keep warm at 80-95°C for 60-90 minutes after the dropwise addition. After starch liquefaction has a certain temperature...

Embodiment 1

[0045] The preparation method of the thermosetting starch-modified phenolic resin of embodiment 1 comprises following two steps:

[0046] S1: First add 100 parts of phenol, 20 parts of water, 15 parts of corn starch, and 1.5 parts of 50% sulfuric acid catalyst into the reactor, stir, heat to boiling, and keep warm for 60 minutes to obtain a liquefied starch mixture;

[0047]S2: Add sodium hydroxide aqueous solution and adjust the pH value of the liquefied starch mixture to 9, then slowly add 45 parts of 37% formaldehyde solution for the first time and lower the temperature, the reaction temperature is 85°C and keep warm for 50 minutes; slowly add the remaining 110 parts of 37% formaldehyde The solution was maintained at a reaction temperature of 85°C for 70 minutes, stopped heating, cooled the reaction solution, added acid solution to adjust the pH value of the system to 6-7, and dehydrated the reaction solution until the resin viscosity was 3000 mPa·s.

[0048] The molar rati...

Embodiment 2

[0050] Embodiment 2 is based on embodiment 1, and the difference is that the number of parts added of cornstarch is 20 parts; the quality of starch is 20% of that of phenol.

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Abstract

The invention discloses a low thermal conductivity phenolic foam material. The main composition of the foaming raw material includes a thermosetting starch modified phenolic resin, a surfactant, a foaming agent, and an acid curing catalyst. The thermosetting starch modified phenolic resin is composed of phenol, formaldehyde and The liquefied starch is prepared by reacting under alkaline conditions; the alkaline agent under alkaline conditions is one or a combination of two or more of sodium hydroxide, potassium hydroxide and barium hydroxide. The low thermal conductivity phenolic foam material uses thermosetting starch modified phenolic resin as the base material. The foam obtained by foaming and curing has a stable and durable closed-cell structure with high closed-cell rate and low thermal conductivity. It is suitable for thermal insulation building materials and air-conditioning pipes In products with high heat insulation requirements such as cladding materials. The invention also discloses a preparation method of the low thermal conductivity phenolic foam material.

Description

technical field [0001] The invention relates to the technical field of phenolic foam materials, in particular to a low thermal conductivity phenolic foam material and a preparation method. Background technique [0002] Due to its excellent fire resistance, thermal insulation and dimensional stability, phenolic foam is widely used in building exterior wall insulation, central air-conditioning ventilation ducts, etc. [0003] The foaming raw material components of the phenolic foam are as described in CN103694626A, and the phenolic foam is formed by mixing, foaming and curing phenolic resin, foaming agent, surfactant, curing agent or other additives. In recent years, with the development of my country's construction industry, it has become a trend to improve the thermal insulation performance of building structures, reduce resource consumption and pollution emissions, and develop energy-saving buildings. Therefore, making phenolic foam with low thermal conductivity and mainta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/14C08J9/14C08G8/28
CPCC08J9/141C08J9/148C08G8/28C08J2203/14C08J2203/164C08J2361/14C08J2205/052
Inventor 任进福任凯刘涛陈建国
Owner 江阴市威腾铝箔合成材料有限公司
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