Epoxy glue binder for encapsulating of flexible screen

A technology of epoxy glue and adhesive, which is applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve the problems of unsuitable flexible screen packaging bonding, poor storage stability, and high curing temperature, so as to avoid storage Poor stability, low hygroscopicity, and low curing temperature

Pending Publication Date: 2020-01-14
SHENZHEN FISHER NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Traditional one-component epoxy adhesives are mostly high-temperature-cured one-component epoxy adhesives, and the curing temperature is too high, which is not suitable for packaging and bonding of flexible screens
However, some one-component epoxy adhesives cured at low temperature can be cured at a relatively low temperature, resulting in extremely poor storage stability, short service life and difficult to store
Therefore, these two types of one-component epoxy adhesives have great defects and are not suitable for packaging and bonding of flexible screens.

Method used

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  • Epoxy glue binder for encapsulating of flexible screen
  • Epoxy glue binder for encapsulating of flexible screen
  • Epoxy glue binder for encapsulating of flexible screen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Embodiment 1, the specific raw materials required for the preparation of the epoxy adhesive of the present invention are as follows:

[0048] An epoxy adhesive for flexible screen packaging, in parts by weight, comprising:

[0049] 40-60 parts of epoxy resin;

[0050] 5-10 parts of epoxy diluent;

[0051] 30-50 parts of curing agent;

[0052] 0.1-2 parts of photobase generator;

[0053] 0.1-2 parts of stabilizer;

[0054] 5-10 parts of toughening agent;

[0055] Filling 20-40 parts;

[0056] Auxiliary 0.2-2 parts.

[0057] A preferred technical solution of this embodiment: the epoxy resin includes a mixture of one or more of bisphenol A epoxy resin and bisphenol F epoxy resin.

[0058] A preferred technical solution of this embodiment: the epoxy diluent includes a mixture of one or more of oxetane and aliphatic glycidyl ether.

[0059] A preferred technical solution of this embodiment: the curing agent includes a mixture of one or more of the following secondary m...

Embodiment 2

[0075] Please refer to the attached figure 1 , the preparation method of a kind of epoxy glue adhesive of the present invention, this preparation method comprises the following steps:

[0076] Step 1: Weighing according to parts by weight: 40-60 parts of epoxy resin; 5-10 parts of epoxy diluent; 30-50 parts of curing agent; 0.1-2 parts of photobase generator; 0.1-2 parts of stabilizer; 5-10 parts of toughening agent; 20-40 parts of filler; 0.2-2 parts of auxiliary agent;

[0077] Step 2: Add epoxy resin, epoxy diluent, curing agent, photobase generator, stabilizer, toughening agent, and auxiliary agent into the container, use a high-speed disperser to stir and disperse evenly, and then add filler while stirring. Disperse and stir at high speed for 2-3 hours until the mixture is uniform;

[0078] Step 3: Use a three-roller grinder to perform three-roll grinding on the uniformly stirred glue solution, and grind twice until the filler fineness is uniform to form a finished epox...

Embodiment 3

[0081] Weigh the following components:

[0082] Epoxy resin: 40g (bisphenol A epoxy resin of brand EXA-850CRP);

[0083] Epoxy diluent: 5g (oxetane of brand CURALITE OX);

[0084] Curing agent: 50g (mercaptan of grade PE1);

[0085] Catalyst: 0.1g (photobase generator of brand WPBG-018);

[0086] Stabilizer: 0.1g (the stabilizer of brand Hostanox P-EPQ);

[0087] Toughening agent: 5g (polyol of grade CAPA4101);

[0088] Filler: 20g (19g of talc powder of brand HTP1, 1g of fumed silica of brand H20);

[0089] Auxiliary: 0.2g (0.1g of defoamer of brand BYK067A; 0.1g of dispersant of brand BYK9076).

[0090] According to the preparation method in Example 2, add materials, mix, stir and disperse, and three-roll grinding, until it is uniform, then degassing and packaging to obtain the product.

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Abstract

The invention discloses an epoxy glue binder for encapsulating of a flexible screen and a preparation method for the epoxy glue binder. The epoxy glue binder comprises the ingredients in parts by weight: 40-60 parts of epoxy resin, 5-10 parts of epoxy diluent, 30-50 parts of curing agent, 0.1-2 parts of photo base generator, 0.1-2 parts of stabilizer, 5-10 parts of toughener, 20-40 parts of fillerand 0.2-2 parts of auxiliaries. According to the epoxy glue binder for the encapsulating of the flexible screen, disclosed by the invention, light-thermal dual curing can be achieved, the curing temperature is low, and the storage stability is good; and meanwhile, the epoxy glue binder has the advantages of being high in binding power to plastic substrates, good in flexibility, resistant to watercooking and low in hygroscopicity, reaching halogen-free standards and the like, the problems of the traditional mono-component epoxy glue binders that the curing temperature is high, the storage stability is poor, and the like are solved, and the preparation of the epoxy glue binder for the encapsulating of the flexible screen is completed.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an epoxy adhesive for flexible screen packaging. Background technique [0002] With the rapid development of the electronics and information industries, especially the rapid development of consumer electronics products such as smartphones, smart bracelets, TVs, and computers, the display screens are also experiencing a "spherical screen-flat screen" trend. -The rapid evolution and iteration of "flexible screens". Flexible screens have a profound impact and development on the application of wearable equipment because of their flexible and bendable characteristics. In the future, flexible screens will be widely used with the continuous penetration of smart terminals . [0003] The current flexible screen technology is mainly concentrated in two aspects: flexible liquid crystal display technology (Flexible LCD, referred to as FLCD) and flexible organic light-emitting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/66C08G59/68
CPCC08G59/66C08G59/686C09J163/00
Inventor 戚仁宏钟平洪许华兵刘呈贵
Owner SHENZHEN FISHER NEW MATERIALS CO LTD
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