Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Dislocation equalization joint eliminating method and system for large-breadth DLP type 3D printing machine

A 3D printer and elimination system technology, applied in the field of 3D printing, can solve the problems of high molding size cost, affecting the overall quality of the model, etc., to achieve the effect of eliminating seams, good scalability, and improving the quality of the model

Active Publication Date: 2020-01-24
SUZHOU UNIV
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above problems, the purpose of the present invention is to solve the problem in the prior art that the cost of enlarging the molding size of the 3D printer is high, and seams have been formed when splicing projections, which affects the overall quality of the model

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dislocation equalization joint eliminating method and system for large-breadth DLP type 3D printing machine
  • Dislocation equalization joint eliminating method and system for large-breadth DLP type 3D printing machine
  • Dislocation equalization joint eliminating method and system for large-breadth DLP type 3D printing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] For example, the DLP projector used in this embodiment has a resolution parameter of 1280*800 and a projection range of 63.36mm*39.63mm.

[0103]Print in four ways: unstitched (e), one layer divided into two moves and stitched without seams (f), setting overlapping pixels and editing the overlapping area to gray (g), and using the SS-SEM algorithm (h) to print For the sample picture, print a cuboid block with a size of 30mm*15mm*2.5mm.

[0104] After being formed by the method of unspliced ​​(e), it will be a relatively complete piece with a smooth surface, but the size cannot be expanded, and the finished product can be used as a reference for the seam treatment effect.

[0105] Using the method of moving splicing twice in one layer without processing the seam (f), the seam error of 0.1mm is always accumulated in one place, showing a more obvious seam, and the middle splicing part is very fragile and will be damaged from molding When the countertop is removed, it brea...

Embodiment 2

[0110] For example, for a model that does not use the splicing method, the length and width of the original model are smaller than the length and width of the projection surface of the projector before it can be printed. The length, width and height of the original model are enlarged by 2 times, which exceeds the projection capacity of the projector. For the forming range, you need to use mobile splicing to print. Such as Figure 7-9 As shown, the present embodiment selects length 26.37mm, width 20.49mm, height 9.50mm (denoted as V 1 ) with a small wolf head, length 25.00mm, width 25.00mm, height 10.44mm (denoted as V 2 ) turbine and length 38.0mm, width 14.8mm, height 1.5mm (denoted as V 3 ) text relief STL model as a test sample, and the printing result is consistent with the conclusion of the effect evaluation department.

[0111] Such as Figure 10-12 As shown, the methods of printing without splicing, splicing but not eliminating seams, overlapping pixels to process s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a dislocation equalization joint eliminating method and system for a large-breadth DLP type 3D printing machine. The method includes the steps that a three-dimensional model isevenly sectioned, and a section bitmap is generated; dislocation segmentation is conducted on the section bitmap, and a segmentation bitmap is generated; and a moving projector is used for conductingmoving dislocation splicing on the segmentation bitmap, and a three-dimensional model solid is generated. By means of the method, the forming size of the 3D printing machine can be enlarged with small additional cost, the joint problem is well solved, the overall quality of the model is improved, meanwhile, hardware complexity is lowered, and very good expandability is achieved.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a method and a system for eliminating dislocation and equal sharing seams of a large-format DLP type 3D printer. Background technique [0002] In recent years, 3D printing technology has received widespread attention due to the decline in equipment prices and the emergence of related open source projects. 3D printing is a kind of additive manufacturing technology (Additive Manufacturing, AM). According to the principle of layered manufacturing, it adopts the method of precise accumulation, and accumulates materials layer by layer to construct the entity of the three-dimensional model. Compared with traditional manufacturing methods, this technology simplifies the process of mold opening and mold testing, shortens the product development cycle, reduces material waste, and can quickly build objects with very complex internal structures. [0003] DLP-type 3D printers based on D...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B29C64/386B29C64/393B33Y50/00B33Y50/02
CPCB29C64/386B29C64/393B33Y50/00B33Y50/02
Inventor 王宜怀张永潘建张蓉徐昕
Owner SUZHOU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com