The invention discloses a test method for rapidly measuring PCB (
Printed Circuit Board) back drilling, which comprises the following steps of: S1, manufacturing
mask plates containing drilling information and mark points of a PCB based on a PCBGerber file, and accurately attaching the
mask plates to the upper surface and the lower surface of the PCB; s2, building a large-view optical interference measurement
system, imaging the PCB attached with the
mask plate through a parallel light lens in the large-view optical interference measurement
system, scanning the PCB and recording all drilling position information; and S3, performing interference with the
reference plane, and calculating the back drilling depth by using an
optical path difference formula sigma = 2 *
lambda *
delta n according to the recorded drilling position information and the phase of interference imaging. According to the method, the measurement efficiency is remarkably improved, and the problem that a traditional measurement mode cannot meet online full inspection is solved. Through a large-view optical interference scheme, measurement of tens of thousands of holes can be completed within seconds, and compared with traditional
modes such as single-point manual measurement and fixed point
laser measurement, the efficiency is obviously improved, and the
rhythm requirement of online production is completely met.