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A kind of preparation method of epoxy resin thermally conductive adhesive

A technology of epoxy resin and heat-conducting adhesive, which is applied in the field of heat-conducting adhesives, can solve the problems of improved thermal conductivity, poor thermal conductivity of adhesives, and large phonon scattering effect, etc., so as to achieve increased contact surface, excellent thermal conductivity, and increased thermal conductivity. Effect

Active Publication Date: 2021-12-21
JIAXING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the vibration of the macromolecular chain will have a large scattering effect on the phonons, making the thermal conductivity of the adhesive poor.
Intrinsic thermally conductive adhesives can obtain excellent thermal conductivity and mechanical properties at the same time, but the preparation process is complicated and the cost is high
The preparation process of filled thermally conductive adhesives is simple, and is currently the main method for preparing thermally conductive adhesives, but the improvement of thermal conductivity will result in the decrease of mechanical properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A preparation method of epoxy resin thermal adhesive, comprising the following steps:

[0016] S1. Heat the mixed acid of carbon nanotubes, concentrated sulfuric acid and concentrated nitric acid with a volume ratio of 3:1 at 100°C to reflux for 6 hours, after cooling to room temperature, dilute with deionized water, wash and suction filter until the pH value is 7,80 ℃ vacuum drying for 6 hours to obtain purified carbon nanotubes;

[0017] S2. the purified carbon nanotubes in the concentration of 0.1mol / L of SnCl 2 Ultrasound in the solution for 2h for sensitization, and then in PdCl with a concentration of 0.01mol / L 2 Activation by ultrasound for 2 hours in the solution to obtain pretreated carbon nanotubes;

[0018] S3. Electroless copper plating is performed on the pretreated carbon nanotubes under ultrasonic-assisted conditions, and the components of the plating solution are weighed according to the following concentrations, CuSO 4 ·5H 2 O is 7.5g / L, carbon nano...

Embodiment 2

[0022] A preparation method of epoxy resin thermal adhesive, comprising the following steps:

[0023] S1. Heat the mixed acid of carbon nanotubes, concentrated sulfuric acid and concentrated nitric acid with a volume ratio of 3:1 at 100°C to reflux for 6 hours, after cooling to room temperature, dilute with deionized water, wash and suction filter until the pH value is 7,80 ℃ vacuum drying for 6 hours to obtain purified carbon nanotubes;

[0024] S2. the purified carbon nanotubes in the concentration of 0.1mol / L of SnCl 2 Ultrasound in the solution for 2h for sensitization, and then in PdCl with a concentration of 0.01mol / L 2 Activation by ultrasound for 2 hours in the solution to obtain pretreated carbon nanotubes;

[0025] S3. Electroless copper plating is performed on the pretreated carbon nanotubes under ultrasonic-assisted conditions, and the components of the plating solution are weighed according to the following concentrations, CuSO 4 ·5H 2 O is 7.5g / L, carbon nano...

Embodiment 3

[0029] A preparation method of epoxy resin thermal adhesive, comprising the following steps:

[0030] S1. Heat the mixed acid of carbon nanotubes, concentrated sulfuric acid and concentrated nitric acid with a volume ratio of 3:1 at 100°C to reflux for 6 hours, after cooling to room temperature, dilute with deionized water, wash and suction filter until the pH value is 7,80 ℃ vacuum drying for 6 hours to obtain purified carbon nanotubes;

[0031] S2. the purified carbon nanotubes in the concentration of 0.1mol / L of SnCl 2 Ultrasound in the solution for 2h for sensitization, and then in PdCl with a concentration of 0.01mol / L 2 Activation by ultrasound for 2 hours in the solution to obtain pretreated carbon nanotubes;

[0032] S3. Electroless copper plating is performed on the pretreated carbon nanotubes under ultrasonic-assisted conditions, and the components of the plating solution are weighed according to the following concentrations, CuSO 4 ·5H 2 O is 7.5g / L, carbon nano...

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PUM

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Abstract

The invention provides a preparation method of epoxy resin thermally conductive adhesive, comprising the following steps: S1. preparing purified carbon nanotubes; S2. preparing pretreated carbon nanotubes; S3. preparing copper-coated carbon nanotubes; S4. Prepare yttrium oxide reinforced copper-coated carbon nanotubes; S5. Weigh E-51 epoxy resin for preheating, then add yttrium oxide to strengthen copper-coated carbon nanotubes, and add allyl glycidyl ether, after fully stirring, finally add ethyl ether Diamine, after fully stirring, is formulated into epoxy resin thermally conductive adhesive. The thermal conductive adhesive of the present invention is combined with copper and carbon nanotubes, and when added to the matrix resin as a thermal conductive filler, the thermal conductivity will be increased, but the surface of the copper-coated carbon nanotubes is "rough", and the yttrium oxide is partially embedded in the Cu matrix, increasing the thermal conductivity. The contact surface is formed to form a heat conduction path, which makes the heat conduction performance better.

Description

technical field [0001] The invention relates to the field of thermally conductive adhesives, in particular to a preparation method of epoxy resin thermally conductive adhesives. Background technique [0002] With the continuous development of large-scale integrated circuits and the miniaturization of electronic components, the heat dissipation of electronic devices has become a key issue affecting their service life. Therefore, packaging materials are required to have good thermal conductivity and adhesive properties. Traditional thermal conductive materials are often metal materials, such as Fe, Al, Cu, etc. Metal materials conduct heat through the transfer of internal electrons, and have excellent thermal conductivity, but metal materials have extremely poor bonding properties and cannot be used as adhesives. Adhesive is a kind of polymer, usually a saturated system, without free electrons inside, and often conducts heat through phonons. However, the vibration of the mac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04
CPCC09J163/00C09J11/04C08K2003/221C08K2201/011C08K9/02C08K3/041C08K3/22
Inventor 沈丽尧
Owner JIAXING UNIV