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High-thermal-conductivity composite graphite cooling fin and preparation method thereof

A technology of composite graphite and heat sink, which is applied to chemical instruments and methods, modification through conduction and heat transfer, and other household appliances, etc. It can solve the problem that heat cannot be transferred in time, reduce the thermal conductivity of carbon material layers, and weaken the heat dissipation effect of graphite film, etc. problems, and achieve the effects of low cost, wide range of availability, and simple preparation process

Inactive Publication Date: 2020-02-04
WUXI JONES TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The above technology can improve the longitudinal thermal conductivity of the graphite film to a certain extent, but the use of the binder will seriously reduce the thermal conductivity of the carbon material layer, causing the heat emitted by the graphite film to be unable to be transferred to the copper in time, seriously weakening the thermal conductivity of the carbon material layer. Heat dissipation effect of graphite film

Method used

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  • High-thermal-conductivity composite graphite cooling fin and preparation method thereof
  • High-thermal-conductivity composite graphite cooling fin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] A composite graphite heat sink is prepared by using a 34 μm thick single-layer graphite film. The graphite film is prepared by high-temperature carbonization and graphitization of a polyimide film, and then vacuum magnetron sputtering Ti on both sides of the graphite film at the same time. (200nm) and Cu (1800nm) sputtering layer, and then cut the sputtered composite graphite film into 200*200mm square slices, stack up to 9 layers vertically, and the upper and lower outermost layers of the superimposed heat sink are single-layer graphite The superimposed composite graphite film is put into the designated tooling of the hot-press furnace for high-temperature and high-pressure welding and pressing.

[0027] The process of welding and pressing is as follows:

[0028] 0-650°C, pressure 0MPa, heating rate 5°C / min, and hold at 650°C for 60 minutes; 650-850°C, pressure rises to 20MPa, heating rate 10°C / min, and hold at 850°C for 60 minutes; 850-980°C , the pressure was mainta...

Embodiment 2

[0031] A composite graphite heat sink is prepared by using a 34 μm thick single-layer graphite film. The graphite film is prepared by high-temperature carbonization and graphitization of a polyimide film, and then vacuum magnetron sputtering Ti on both sides of the graphite film at the same time. (200nm) and Cu (1800nm) sputtering layer, and then cut the sputtered composite graphite film into 200*200mm square slices, stack up to 6 layers vertically, and the upper and lower outermost layers of the superimposed heat sink are single-layer graphite The superimposed composite graphite film is put into the designated tooling of the hot-press furnace for high-temperature and high-pressure welding and pressing.

[0032] The process of welding and pressing is as follows:

[0033] 0-650℃, pressure 0MPa, heating rate 10℃ / min, and keep at 650℃ for 120min; 650-850℃, pressure rise to 10MPa, heating rate 10℃ / min, and keep at 850℃ for 120min; 850-980℃ , the pressure was maintained at 20MPa, ...

Embodiment 3

[0036] A composite graphite heat sink is prepared by using a 34 μm thick single-layer graphite film. The graphite film is prepared by high-temperature carbonization and graphitization of a polyimide film, and then vacuum magnetron sputtering Ti on both sides of the graphite film at the same time. (200nm) and Cu (1800nm) sputtering layer, and then cut the sputtered composite graphite film into 200*200mm square slices, stack up to 4 layers vertically, and the upper and lower outermost layers of the superimposed heat sink are single-layer graphite The superimposed composite graphite film is put into the designated tooling of the hot-press furnace for high-temperature and high-pressure welding and pressing.

[0037] The process of welding and pressing is as follows:

[0038] 0-650℃, pressure 0MPa, heating rate 7.5℃ / min, and keep at 650℃ for 30min; 650-850℃, pressure 0MPa, heating rate 10℃ / min, and keep at 850℃ for 30min; 850-980℃, pressure Maintain at 20MPa, the heating rate is 1...

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Abstract

The invention belongs to the technical field of material preparation, and particularly relates to a high-thermal-conductivity composite graphite cooling fin and a preparation method thereof. The high-thermal-conductivity composite graphite cooling fin adopts composite graphite layers as cooling units, the cooling fin is formed by the multiple composite graphite layers which are superimposed in thelongitudinal direction, and each composite graphite layer comprises a metal transition layer and a single-layer graphite film, wherein the metal transition layers are deposited on the surfaces of thesingle-layer graphite films, and the cooling fin is formed by the multiple composite graphite layers which are welded and laminated. According to the preparation method, the composite graphite cooling fin with the thickness being 0.08-1.0 mm can be prepared, and the usable range of a product is wide; and the interior of the prepared composite graphite cooling fin is free of adhesives, a metal andgraphite direct bonding mode is adopted, the prepared composite graphite cooling fin can keep the thermal-conduction advantage of a composite graphite sheet in the horizontal direction and can also improve the longitudinal thermal conductivity of the composite graphite sheet, a preparation process is simple, and the cost is low.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and in particular relates to a high thermal conductivity composite graphite heat sink and a preparation method thereof. Background technique [0002] In recent years, with the development of the electronics industry, it is becoming increasingly important to solve the heating problem of electronic equipment. At present, artificial graphite has excellent thermal conductivity, and artificial graphite film is made of polyimide film (Polyimide abbreviated as PI) after carbonization and graphitization, or natural graphite is used to make flexible artificial graphite film. However, the vertical thermal conductivity of artificial graphite film is low, only 5-10W / m·K. In order to maintain the surface thermal conductivity of the graphite material and improve the longitudinal thermal conductivity, in the existing technology, such as the method disclosed in the patent CN105584122A, the carbon m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B33/00B32B37/06B32B37/10B32B7/08B32B38/18C23C14/18C23C14/35H05K7/20
CPCB32B7/08B32B9/007B32B9/04B32B33/00B32B37/06B32B37/10B32B38/1808B32B2037/0092B32B2037/243B32B2255/205B32B2307/302B32B2309/022B32B2309/025B32B2309/125B32B2457/00C23C14/185C23C14/35H05K7/2039
Inventor 陈曲唐文军杨朝晖吴晓宁朱光福
Owner WUXI JONES TECH
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