High-flexibility two-component epoxy putty and curing application method thereof on metal
A technology of epoxy putty and application method, which is applied in the direction of container discharge method, container filling method, container structure installation device, etc., can solve problems such as difficult fixation, difficult bonding and shock absorption, poor effect, etc., to prevent Shaking, good adhesion effect
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Embodiment 1
[0026] The present invention discloses a high-flexibility two-component epoxy putty, including component A and component B mixed with a weight ratio of 10:1; wherein,
[0027] The A component includes the following parts by weight: 25 parts of epoxy resin, 10 parts of attapulgite, 5 parts of nano silicon dioxide, 5 parts of intumescent flame retardant, 3 parts of thixotropic stearic acid amide and treatment 1 part of treatment agent, said treatment agent includes thickener hydroxypropyl methylcellulose and preservative added in a mass ratio of 1:1;
[0028] The B component includes the following components in parts by weight: 10 parts of low-molecular resin 128 resin, 3 parts of aliphatic polyamine curing agent, 1 part of antioxidant 1010 and 1 part of thixotropic stearic acid amide.
[0029] Other components in the above formula that are not listed or are used to illustrate specific components are commonly used components in this field.
[0030] The curing application method...
Embodiment 2
[0046] The present invention discloses a highly flexible two-component epoxy putty, comprising component A and component B mixed with a weight ratio of 10:3; wherein,
[0047] The A component includes the following parts by weight: 30 parts of epoxy resin, 15 parts of attapulgite, 10 parts of nano silicon dioxide, 10 parts of intumescent flame retardant, 5 parts of thixotropic stearic acid amide and treatment 5 parts of agent, described treatment agent comprises thickener hydroxypropyl methylcellulose and preservative added with the mass ratio of 1:1;
[0048] The B component includes the following components in parts by weight: 15 parts of low-molecular resin 128 resin, 5 parts of aliphatic polyamine curing agent, 3 parts of antioxidant 1010 and 3 parts of thixotropic stearic acid amide.
[0049] Other components in the above formula that are not listed or are used to illustrate specific components are commonly used components in this field.
[0050] The curing application m...
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Abstract
Description
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