Circuit board with embedded capacitor and manufacturing method thereof
A manufacturing method and circuit board technology, applied to parts with fixed capacitance, removing conductive materials by chemical/electrolytic methods, containing printed capacitors, etc., can solve the problems of complex process, high cost, high dielectric constant, etc., and achieve The effect of cost reduction, cost reduction, and simple process
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[0024] Such as figure 1 and figure 2 The circuit board manufacturing method with embedded capacitors shown is characterized in that it includes the steps of: wet film coating / dry film lamination, exposure, development, line etching, film removal, surface treatment, printing, and baking.
[0025] Specifically include the following steps:
[0026] Step A: Coating wet film / laminating dry film on the copper foil surface of the circuit board;
[0027] Step B: Exposing and developing to form the protective layer of the required ordinary circuit pattern and the parallel circuit of the capacitor plate;
[0028] Step C: removing the copper foil without protective layer by etching, leaving the required ordinary copper lines and the parallel lines 1 of the capacitor plates;
[0029] Step D: remove the film, remove the surface protection layer, and obtain the required ordinary circuit and the parallel circuit 1 of the capacitor plate;
[0030] Step E: Carrying out tinning surface tre...
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