Thick-film resistance paste suitable for porous ceramics and preparation method thereof
A technology of thick-film resistors and porous ceramics, applied in thick-film resistors, heat treatment equipment, resistors, etc. Large-scale production and other issues to achieve good atomization effect
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Embodiment 1
[0017] A method for preparing a thick film resistance slurry suitable for porous ceramics specifically includes the following steps:
[0018] Step S1: preparing materials and mixing milling, configuring flake silver powder, spherical silver powder and palladium powder in proportion, using absolute ethanol as the grinding medium, ball milling for 2 hours, and drying;
[0019] Specifically, the weight of the silver powder is a, including flake silver powder and spherical silver powder with a weight ratio of 4:1, the particle size D50 of the flake silver powder is 5-10 microns, and the particle size D50 of the spherical silver powder is 0.1-0.3 microns; the weight of the palladium powder is b , where a / b is 99:1.
[0020] Step S2: heat treatment, the mixture prepared in step S1 is heat-treated at 300°C / 60min, and sieved with a 200-mesh sieve; by first preparing a silver-palladium alloy, the performance of silver is improved by using palladium.
[0021] Step S3: Rolling and mixin...
Embodiment 2
[0026] The implementation steps of this embodiment and example one are basically the same, the main difference is the difference in the proportioning composition of raw materials, wherein the weight of silver powder is a, the weight of palladium powder is b, and the specific a / b is 98:2, ruthenium dioxide powder The weight of is c, where c / (a+b)=0.1. Print the thick film resistor paste prepared according to the above steps on the surface of 99 alumina tiles with a film thickness of 20-25 microns. After heat treatment at 830°C / 20min, use a four-probe square resistance meter to measure its square resistance. The square resistance value is 48mΩ / £; the above slurry is printed on porous ceramics (porosity 45-60%, pore size 20-30 microns, the resistance value is controlled by printing pattern size and film thickness to 1±0.05 ohms), after After heat treatment at 830°C / 20min, the resistance R20 and R350 at two temperature points of 20°C and 350°C were measured with a temperature coef...
Embodiment 3
[0028] The implementation steps of this embodiment and example one are basically the same, the main difference is the difference in the proportioning composition of raw materials, wherein wherein the weight of silver powder is a, the weight of palladium powder is b, and the specific a / b is 97:3, ruthenium dioxide The weight of powder is C, where c / (a+b)=0.05. Print the thick film resistor paste prepared according to the above steps on the surface of 99 alumina tiles with a film thickness of 20-25 microns. After heat treatment at 830°C / 20min, use a four-probe square resistance meter to measure its square resistance. The square resistance value is 59mΩ / £; the above slurry is printed on porous ceramics (porosity 45-60%, pore size 20-30 microns, the resistance value is controlled by printing pattern size and film thickness 1±0.05 ohms), after After heat treatment at 830°C / 20min, the resistance R20 and R350 at two temperature points of 20°C and 350°C were measured with a temperatur...
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Abstract
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