Double-layer dielectric substrate multi-frequency high-gain microstrip slot antenna

A dielectric substrate and microstrip slot technology, which is applied in slot antennas, antennas, antenna grounding devices, etc., can solve the problems of single resonance frequency point of the antenna, insufficient far-field radiation gain of the antenna, etc., and achieve low processing cost, low profile characteristics, The effect of simple antenna structure

Active Publication Date: 2020-02-21
榆林禹创易盛网络科技有限公司
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Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-frequency high-gain microstrip slot antenna with a double-layer dielectric substrate, which can extend the single-frequency resonance slot antenna It is a multi-frequency antenna that resonates at four frequency points, and at the same time greatly improves the far-field radiation gain of the antenna to achieve multi-frequency resonance and high-gain radiation

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  • Double-layer dielectric substrate multi-frequency high-gain microstrip slot antenna
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Embodiment Construction

[0020] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0021] In order to solve the problem of single resonant frequency point and low gain of the microstrip slot antenna, the present invention adds a dielectric substrate and four triangular metal patches to the structure of the microstrip slot antenna, and further cuts the triangles at two diagonal positions The trapezoidal structure is formed by removing two small triangular arms, thereby changing the single-frequency gain microstrip slot antenna into a multi-frequency high-gain antenna structure.

[0022] see Figure 1-4 In the present invention, two dielectric substrates with the same geometric structure and metal patch structure printed on the surface are closely bonded together to form a complete antenna structure. The entire lower surface of the lower dielectric substrate 20 is covered with the metal grounding plate 18. At the center of the metal groundin...

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Abstract

The invention discloses a double-layer dielectric substrate multi-frequency high-gain microstrip slot antenna. The antenna comprises two rectangular dielectric substrates which are stacked together. Four right triangle metal patches are arranged on an upper surface of an upper dielectric substrate. The four right triangle metal patches are equal in size, and right angles are oppositely spliced into a rhombus structure. A first triangular patch, a second triangular patch, a third triangular patch and a fourth triangular patch are successively arranged in an anticlockwise direction, and isosceles right triangles with the same size are cut off from right angles of the first triangular patch and the third triangular patch respectively to form two trapezoidal structures. A rectangular metal patch is arranged on an upper surface of the upper dielectric substrate of a vertical gap. A lower surface of a lower dielectric substrate covers a metal grounding plate, the metal grounding plate is provided with a rectangular gap, a circular via hole corresponding to a tail portion of the rectangular metal patch penetrates through the lower dielectric substrate, and the metal grounding plate is provided with a circular feed port corresponding to the circular via hole. In the invention, multi-frequency resonance high-gain radiation can be realized.

Description

technical field [0001] The invention belongs to the field of wireless communication, in particular to a multi-frequency high-gain microstrip slot antenna with a double-layer dielectric substrate. Background technique [0002] While the rapid development of information technology has brought great convenience to human life, it is also changing people's traditional production and lifestyle. Especially after the arrival of the fifth-generation wireless communication technology characterized by high speed, low latency and large capacity, many things in society can be connected to the Internet to form an Internet of Things system. As a result, human society has entered the era of intelligence and wisdom. The Internet of Things is to connect items with the Internet through information sensing devices such as radio frequency identification (RFID), infrared sensors, wireless sensing technology, laser scanners, and global positioning systems, for information exchange and communicati...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/36H01Q1/38H01Q1/48H01Q1/50H01Q13/10
CPCH01Q1/38H01Q1/36H01Q1/50H01Q1/48H01Q13/106
Inventor 崔娟娟黄海飞张雅琼冯治东
Owner 榆林禹创易盛网络科技有限公司
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