Chlorine-containing compound delivery method and device

Abstract

The invention provides a method and device for conveying chlorine-containing compounds. The method comprises: heating the chlorine-containing compound solution to convert the chlorine-containing compound solution into a chlorine-containing compound gas; adjusting the flow rate of the chlorine-containing compound gas to a set value value; the chlorine-containing compound gas is mixed with oxygen and delivered to the reaction chamber for the process. The technical solution of the chlorine-containing compound delivery method and device provided by the present invention can realize precise control of gas consumption, improve process efficiency, and simultaneously improve overall process consistency.

Description

technical field [0001] The present invention relates to the technical field of transporting chlorine-containing oxides, and in particular, to a method and device for transporting chlorine-containing compounds. Background technique [0002] In integrated circuit technology, thermal oxidation is an indispensable process technology. Early people found that boron, phosphorus, arsenic and other impurity elements in SiO 2 The diffusion rate in (silicon dioxide) is much slower than in Si, which makes SiO 2 Thin films can be widely used in device production as masks for selective diffusion and facilitate the emergence of silicon surface technology. At the same time, the SiO grown on the Si surface 2 The film not only has good adhesion with Si, but also has very stable chemical properties and electrical insulation. Therefore, SiO 2 It plays an extremely important role in integrated circuits. [0003] SiO commonly used in semiconductor device production 2 The production methods...

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Problems solved by technology

[0005] However, due to the need for nitrogen as a transport medium to transfer C 2 h 2 CL 2 Bring into reaction chamber for process, C 2 h 2 CL 2 The reaction quality of the solution cannot be measured, cannot be quantitatively analyzed, and can only be adjusted according to the process effect. At the same time, the liquid C 2 h 2 CL 2 chemically more active than gaseous C 2 h 2 CL 2 Low chemical activity, resulting in reduced process efficiency

Moreover, liquid C 2 h 2 CL 2 When flowing in the pipeline, it is easy to adhere to the surface of the pipeline, which makes it difficult to purge the pipeline after the process and is not easy to remove. The residual liquid C in the pipeline in the next process 2 h 2 CL 2 Enter the reaction chamber to participate in the process, affecting the overall process consistency

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