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High-thermal-conductivity and high-insulation thermoplastic resin composition as well as preparation method and application thereof

A thermoplastic resin and high insulation technology, which is applied in the field of integrated circuit interconnection dielectric materials, can solve the problems of poor thermal conductivity of formulas, limited application range, long curing time, etc., and achieve the effect of improving thermal conductivity

Inactive Publication Date: 2020-03-06
广东莱尔新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, at present, the bonding between the layers of circuit boards in the existing electronics industry uses thermosetting insulating adhesive films, which require a relatively long curing time and have relatively high requirements for storage conditions (usually low temperature and low humidity and other demanding conditions are required. ), which is inconvenient to use; in addition, the thermal conductivity of the system formula used is poor, resulting in the thermal conductivity of the film generally not exceeding 0.2W / (m K), which limits its scope of use

Method used

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  • High-thermal-conductivity and high-insulation thermoplastic resin composition as well as preparation method and application thereof
  • High-thermal-conductivity and high-insulation thermoplastic resin composition as well as preparation method and application thereof
  • High-thermal-conductivity and high-insulation thermoplastic resin composition as well as preparation method and application thereof

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Embodiment 1-8

[0051] A thermoplastic adhesive film with high thermal conductivity and high insulation is prepared according to the following steps:

[0052] (1) Preparation of carboxyl-terminated polysiloxane-modified epoxy resin: Stir and heat 100 parts of hydroxyl-terminated polysiloxane (viscosity: 5000cps) to 120°C for 2 hours under a vacuum of 0.1Mpa, drop Add 20 parts of tetrahydrophthalic anhydride to continue the reaction for 3 hours to generate modified carboxyl-terminated polysiloxane; then add 30 parts of the modified carboxyl-terminated polysiloxane to 100 parts of epoxy resin, and add 1 part Disperse dimethylimidazole for 40 minutes, heat up to 80°C for 2 hours under stirring, and generate thermoplastic carboxyl-terminated polysiloxane modified epoxy resin;

[0053] (2) Preparation of dendritic three-dimensional graphene oxide: 50 parts of absolute ethanol and 50 parts of deionized water are mixed to obtain a mixed solution of absolute ethanol and deionized water, and 30 parts ...

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Abstract

The invention relates to the technical field of integrated circuit interconnection dielectric materials, and in particular, relates to a high-thermal-conductivity and high-insulation thermoplastic resin composition as well as a preparation method and an application thereof. The invention discloses the preparation method of the high-thermal-conductivity and high-insulation thermoplastic resin composition. The preparation method comprises the following steps: (1) preparation of carboxyl-terminated polysiloxane modified epoxy resin; (2) preparation of dendritic three-dimensional graphene oxide; and (3) preparation of the high-thermal-conductivity and high-insulation thermoplastic resin composition: adding the dendritic three-dimensional graphene oxide into the carboxyl-terminated polysiloxanemodified epoxy resin, and mixing and stirring to obtain the high-thermal-conductivity and high-insulation thermoplastic resin composition. The invention aims to provide the preparation method of thehigh-thermal-conductivity and high-insulation thermoplastic resin composition; the resin composition prepared by the preparation method has high thermal conductivity and high insulation, the thermal conductivity coefficient can be adjusted according to a formula, and the resin composition has good thermal conductivity, excellent insulation performance, and wide application range.

Description

technical field [0001] The invention relates to the technical field of interconnection dielectric materials for integrated circuits, in particular to a thermoplastic resin composition with high thermal conductivity and high insulation, a preparation method and application thereof. Background technique [0002] With the rapid development of microelectronic high-density assembly technology and integration technology, the assembly density of electronic equipment has been rapidly increased, making electronic components and logic circuits smaller by tens of millions of times. At this time, the heat generated by electronic equipment will increase sharply. , and at the ambient temperature, composite insulating materials with high thermal conductivity are extremely important to make electronic components work normally with high reliability. [0003] Epoxy resin is a widely used resin. It has excellent processing performance, good mechanical properties, high electrical insulation, co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/10C08K9/04C08K7/00C08K3/04C08G77/42C08J5/18
CPCC08G77/42C08J5/18C08J2383/10C08K7/00C08K9/04C08K3/042C08L83/10
Inventor 李政何志球
Owner 广东莱尔新材料科技股份有限公司
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